THS770006

www.ti.com

SBOS520B

– JULY 2010 – REVISED JANUARY 2012

ELECTRICAL CHARACTERISTICS (continued)

and output, and input and output referenced to midsupply, unless otherwise noted. Measured using evaluation module as

discussed in Test Circuits section.

TEST

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

POWER SUPPLY

Specified operating voltage

4.75

5

5.25

V

C

85

100

115

mA

A

Quiescent current

80

125

mA

B

60

90

dB

A

Power-supply rejection ratio

59

dB

B

POWER-DOWN

Enable voltage threshold

Device powers on below 0.5V

0.5

V

A

Disable voltage threshold

Device powers down above 2.0V

2

V

A

Power-down quiescent current

0.8

3

mA

A

Input bias current

80

100

µA

A

Turn-on time delay

10

µs

C

Turn-off time delay

0.15

µs

C

THERMAL CHARACTERISTICS

Specified operating range

–40

+85

°C

C

Thermal resistance,

(3)

Junction to case (bottom)

8.9

°C/W

C

Thermal resistance,

(3)

Junction to ambient

44.1

°C/W

C

(3)

Tested using JEDEC High-K test PCB. Thermal management of the final printed circuit board (PCB) should keep the junction

temperature below +125

°C for long term reliability.

Copyright

© 2010–2012, Texas Instruments Incorporated

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