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LMV612MMXNOPB Datasheet(PDF) 1 Page - National Semiconductor (TI) |
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LMV612MMXNOPB Datasheet(HTML) 1 Page - National Semiconductor (TI) |
1 / 28 page LMV611, LMV612, LMV614 www.ti.com SNOSC69B – APRIL 2012 – REVISED MARCH 2013 LMV611 Single/LMV612 Dual/LMV614 Quad 1.4 MHz, Low Power General Purpose, 1.8V Operational Amplifiers Check for Samples: LMV611, LMV612, LMV614 1 FEATURES DESCRIPTION The LMV611/LMV612/LMV614 are single, dual, and 2 • (Typical 1.8V Supply Values; Unless Otherwise quad low voltage, low power Operational Amplifiers. Noted) They are designed specifically for low voltage general • Ensured 1.8V, 2.7V and 5V Specifications purpose applications. Other important product • Output Swing characteristics are, rail to-rail input/output, low supply voltage of 1.8V and wide temperature range. The – w/600 Ω Load 80mV from Rail LMV611/LMV612/LMV614 input common mode – w/2k Ω Load 30mV from Rail extends 200mV beyond the supplies and the output • VCM 200mV Beyond Rails can swing rail-to-rail unloaded and within 30mV with 2kohm load at 1.8V supply. The LMV611/2/4 • Supply Current (Per Channel) 100 μA achieves a gain bandwidth of 1.4MHz while drawing • Gain Bandwidth Product 1.4MHz 100 uA (typ) quiescent current. • Maximum VOS 4.0mV The industrial-plus temperature range of −40°C to • Temperature Range −40°C to 125°C 125°C allows the LMV611/LMV612/LMV614 to accommodate a broad range of extended APPLICATIONS environment applications. • Consumer Communication The LMV611 is offered in the tiny 5-Pin SC70 • Consumer Computing package, the LMV612 in space saving 8-Pin VSSOP and SOIC, and the LMV614 in 14-Pin TSSOP and • PDAs SOIC. These small package amplifiers offer an ideal • Audio Pre-Amp solution for applications requiring minimum PCB • Portable/Battery-Powered Electronic footprint. Applications with area constrained PC board requirements include portable and battery operated Equipment electronics. • Supply Current Monitoring • Battery Monitoring Typical Application 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright © 2012–2013, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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