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LMV951 Datasheet(PDF) 2 Page - National Semiconductor (TI) |
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LMV951 Datasheet(HTML) 2 Page - National Semiconductor (TI) |
2 / 24 page LMV951 SNOSAI3C – OCTOBER 2006 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) ESD Tolerance (3) Human Body Model 2000V Machine Model 200V Supply Voltage (V+ – V−) 3.1V VIN Differential ±0.3V Voltage at Input/Output Pin V+ +0.3V, V− −0.3V Current at Input Pin ±10 mA Junction Temperature (4) +150°C Mounting Temperature Infrared or Convection (20 sec) 235°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (4) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC Board. OPERATING RATINGS (1) Temperature Range (2) −40°C to +125°C Supply Voltage 0.9V to 3V Thermal Resistance ( θJA) (2) 170°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC Board. 2 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LMV951 |
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