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8-147099-0 Datasheet(PDF) 5 Page - Tyco Electronics

Part No. 8-147099-0
Description  Mod IV Receptacle Assemblies, Single-Row, Outrigger Design .100 x .100 2.54 x 2.54 Centerline, End To End Stackable
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Maker  MACOM [Tyco Electronics]
Homepage  http://www.macom.com
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185
Catalog 1307819
Dimensions are in inches and
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-2103-6000
Revised 8-08
millimeters unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
www.tycoelectronics.com
are metric equivalents.
to change.
C. America: 52-55-1106-0803
UK: 44-8706-080-208
Mod IV Surface Mount Vertical Receptacle Assemblies,
.100 x .100 [2.54 x 2.54] Centerline
AMPMODU Interconnection System
5
The AMPMODU 0.025 [0.64]
square interconnection
system is an industry
standard that has provided
level III and IV thru-hole
interconnections to almost
every industry and
marketplace for years.
As technology advances,
so has the AMPMODU
product line.
Surface mount vertical
receptacle assemblies are
available to meet your level
II packaging needs as
process technologies
evolve from wave soldering
to surface mount reflow
(infrared and vapor-phase)
processes. AMPMODU
surface mount receptacle
assemblies are offered in
vertical dual entry
configurations. These
receptacles are available in
single-row and double-row
configurations with a
contact centerline spacing
of .100 x .100 [2.54 x 2.54].
AMPMODU surface mount
vertical receptacle
assemblies continue to
provide the proven features
and benefits of their
thru-hole counterparts in the
AMPMODU product family.
Closed-entry style housing
design provides a lead-in
ramp for positive mating of
contacts, virtually eliminating
the possibility of stubbing.
The dual-beam receptacle
contact design, coupled with
gold plating in the contact
area, provides a reliable
interface. Tin plating on the
solder tails also enhances
solderability.
The incorporation of
compliant metallic hold
downs on receptacle
assemblies offers multiple
benefits. The hold downs
provide for proper lead-to-
pad registration and provide
retention to the PC board
prior to and during
processing. Used with a
plated thru-hole, the hold
downs are soldered during
the reflow process and
serve as a strain relief for
the solder joints during
mating/unmating.
The design of the hold
downs results in an
excellent ratio of
insertion/extraction forces
(into the PC board); 20 lb.
[89 N] maximum insertion
force per pair and 10 lb.
[44.5 N] minimum extraction
force per pair (unsoldered).
No tools are required for
insertion.
Product Facts
Surface Mount Leads
Contact Material:
phosphor bronze
High temperature, black
thermoplastic housings,
94V-0 rated, capable of
withstanding IR or vapor-
phase reflow
Gold/tin duplex plating
for reliable mating
interconnection and solder
interface
Metallic hold downs provide
retention in the PC board
prior to and during the
reflow process … and strain
relief after soldering
Hold downs provide for
proper lead-to-pad
registration
Closed-entry receptacle
housings provide lead-in
ramp for positive mating
Receptacle contacts employ
dual cantilever beams for
reliable connections
Recognized under the
Component Program
of Underwriters
Laboratories Inc.
File No. E28476
Certified by
Canadian Standards
Association,
File No. LR 7189
R
R




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