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9-1469373-9 Datasheet(PDF) 23 Page - Tyco Electronics |
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9-1469373-9 Datasheet(HTML) 23 Page - Tyco Electronics |
23 / 32 page 23 Catalog 3-1773445-8 Dimensions are in millimeters Dimensions are shown for USA: 1-800-522-6752 South America: 55-11-2103-6000 Revised 6-07 and inches unless otherwise reference purposes only. Canada: 1-905-470-4425 Hong Kong: 852-2735-1628 specified. Values in brackets Specifications subject Mexico: 01-800-733-8926 Japan: 81-44-844-8013 www.tycoelectronics.com are U.S. equivalents. to change. C. America: 52-55-1106-0803 UK: 44-8706-080-208 Product Compliant to xTCA or AdvancedMC Specifications (Continued) Solutions for AdvancedTCA, AdvancedTCA 300, MicroTCA, and AdvancedMC Standards AdvancedMC, AdvancedTCA, AdvancedTCA 300, MicroTCA and PICMG are trademarks of PICMG-PCI Industrial Computer Manufacturers Group Incorporated. Thermal Interface Products are mandatory for reducing the waste heat and cooling the system in the most efficient way. Waste heat reduces the silicon chip reliability and performance. In addition to the products Tyco Electronics is offering such as Heat Sinks, Heat Pipes and CHIP COOLERs, in all shapes and sizes, Tyco Electronics offers state of the art Thermal Management Services. Thermal Management is the design practice of moving waste heat to locations that do not affect the equipment or overall device performance. Each Thermal Product can be fully customized to fulfill the specific requested system cooling requirements. www.tycoelectronics.com/products/atca www.thermal.tycoelectronics.com Catalog 1309431 Flyer 1308225 AdvancedTCA — Thermal Products & Services FEATURES • Tyco Electronics thermal solutions provide optimum cooling for active components like BGA (Ball Grid Array), MCM modules, opti- cal modules and power devices • Compatible to most AdvancedTCA connector form factors, low profile solutions • Off the shelf as well as customized products • Heat pipe technology in combin- ation with passive heat sinks • Advanced thermal conductive polymer for weight and cost reduction • Full CFD (Computational Fluid Dynamics) simulation and analy- sis, optimum Thermal design numerical and analytical approaches Tyco Electronics’ MRJ21 receptacle is a high density I/O interconnect. This high density connector supports AdvancedMC Mid-size and Full-size module face plates and AdvancedTCA face plates. It can also be used for Rear I/O via Rear Transition Modules (RTMs), as well as in AdvancedTCA Zone 3 applications. The MRJ21 connector is fully shielded and provides density savings for current 10/100 or GbE RJ45/RJ21 applications. The low profile and narrow width design will allow more ports to be packed into less space. Tyco Electronics offers a full end-user solution with cleaner cabling solutions over RJ45s, and patch panels for plug-and-play environment, including data centers and zone cabled or open office environments. www.tycoelectronics.com/products/atca AdvancedTCA — Front & Rear I/O Connectors — MRJ21 Receptacles FEATURES • 1.5 to 3 times the port density of stacked Mod Jacks (RJ45). 3 times the port density of RJ21 • Contact layout and footprint for differential pairs creates reduced cross-talk and built in compensa- tion • Connector is designed to meet or exceed Cat 5e cross-talk • Fully shielded system to control EMI (Electro-magnetic Interference) • Robust die cast cable covers pro- vide 45 degrees left or right cable exit for ease of routing • 1 mm pair spacing, 1.5 mm pair to pair spacing • Patch panels and cable manage- ment solutions available MRJ21 PCB Receptacles (48-position) Part Number Panel PCB Grounds Termination 1761482-1 No Solder 1761482-2 Yes Solder 1761482-4 No Press-Fit Screwlocks sold separately Receptacle Screwlocks Part Number Panel Thickness 1339381-1 < 1mm 1339381-2 > 1mm to < 2mm Note: Part Numbers are RoHS compliant. |
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