Spark Gap Protectors (SPG)

Revision September 25, 2013

4 / 5

@ SOCAY Electronics Co., Ltd. 2013

Specifications are subject to change without notice.

Please refer to www.socay.com for current information.

SCB Series

SOCAY Electronics Co., Ltd.

www.socay.com

Flow Soldering Conditions

Reflow Soldering Conditions

1) Time shown in the above figures is measured from the point when chip surface reaches temperature.

2) Temperature difference in high temperature part should be within 110℃ .

3) After soldering, do not force cool, allow the parts to cool gradually.

Hand Soldering

Solder iron temperature: 350

±5℃

Heating time: 3 seconds max.

General attention to soldering

u

High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence

strength, and the change of characteristic may occur.

u

For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures exceeding

200℃ to fewer than 50 seconds.

u

Please use a mild flux (containing less than 0.2wt% CI). Also, if the flux is water soluble, be sure to wash thoroughly to

remove any residue from the underside of components that could affect resistance.

Cleaning

When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause cracking or

a decrease in the adherence of the termination, we recommend that you use the conditions below:

Frequency: 40kHz max.

Output power: 20W/liter

Cleaning time: 5 minutes max.

Recommended Soldering Conditions

250

Soldering

Cooling

Air Preheat

200

150

100

50

0

ΔT

150~180℃

260℃

60~120 sec

3~4 sec

250

Soldering

Cooling

Air Preheat

200

150

100

50

0

ΔT

150~180℃

260℃

60~120 sec

10 sec. or less

60 sec. or less