HALL-EFFECT LATCHES

FOR HIGH-TEMPERATURE

OPERATION

www.allegromicro.com

Dwg. MA-009-3A in

1

23

0.072

0.064

0.167

0.155

0.059

BSC

0.0189

0.0142

0.047

0.035

0.102

0.090

0.063

0.055

0.0173

0.0138

0.090

0.084

0.0221

0.0173

0.118

BSC

0.181

0.173

Dwg. MA-009-3A mm

1

23

4.60

4.40

1.83

1.62

4.25

3.94

1.50

BSC

0.48

0.36

1.20

0.89

2.60

2.29

1.60

1.40

0.44

0.35

2.29

2.13

0.56

0.44

3.00

BSC

PACKAGE DESIGNATOR ‘LT’

(SOT89/TO-243AA)

Dimensions in Inches

(for reference only)

Dimensions in Millimeters

(controlling dimensions)

NOTES: 1.

Exact body and lead configuration at vendor’s option within limits shown.

2.

Supplied in bulk pack (500 pieces per bag) or add "TR" to part number for tape and reel.

3.

Only low-temperature (

≤240°C) reflow-soldering techniques are recommended for SOT89 devices.

1

B

0.098

0.031

0.102

0.047

0.181

0.079

Dwg. MA-012-3 in

Pads 1, 2, 3, and A — Standard SOT89 Layout

Pads 1, 2, 3, and B — Low-Stress Version

Pads 1, 2, and 3 only — Lowest Stress, But Not Self Aligning

2

0.028

TYP

0.031

TYP

A

3

13

B

2.5

0.8

2.6

1.2

4.6

2.0

Dwg. MA-012-3 mm

Pads 1, 2, 3, and A — Standard SOT89 Layout

Pads 1, 2, 3, and B — Low-Stress Version

Pads 1, 2, and 3 only — Lowest Stress, But Not Self Aligning

2

0.7

TYP

0.8

TYP

A