CYStech Electronics Corp.

Spec. No. : C737I3

Issued Date : 2012.11.06

Revised Date :

Page No. : 7/8

MTN3023I3

CYStek Product Specification

TO-251AB Dimension

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.2500

0.2618

6.35

6.65

I

0.0866

0.0945

2.20

2.40

B

0.2047

0.2126

5.20

5.40

J

0.2126

0.2244

5.40

5.70

C

0.5709

0.5866

14.50

14.90

K

0.2992

0.3071

7.60

7.80

D

0.0276

0.0354

0.70

0.90

L

0.0453

0.0492

1.15

1.25

E

0.0199

0.0276

0.50

0.70

M

0.0169

0.0228

0.43

0.58

F

0.0886

0.0925

2.25

2.35

N

0.1181 REF

3.00 REF

G

0.0886

0.0925

2.25

2.35

S

0.1969 REF

5.00 REF

H

0.0169

0.0228

0.43

0.58

T

0.1496 REF

3.80 REF

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Marking:

Style: Pin 1.Gate 2.Drain 3.Source

3-Lead TO-251AB Plastic Package

CYStek Package Code: I3

3023

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Product

Name

Date

Code