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SCWL2016101R0MTF Datasheet(PDF) 4 Page - Socay Electornics Co., Ltd. |
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SCWL2016101R0MTF Datasheet(HTML) 4 Page - Socay Electornics Co., Ltd. |
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4 / 5 page  Wire-wound Type Power Inductor Revision February 12, 2014 4 / 5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SCWL201610 Series SOCAY Electronics Co., Ltd. www.socay.com Reflow Condition Pb free assembly -Temperature Min (Ts(min)) +150 °C -Temperature Max (Ts(max)) +200 °C Pre Heat -Time (min to max) (TS) 60 -180 Seconds Average ramp up rate ( Liquidus Temp TL) to peak 3 °C/Second Max TS(max) to TL - Ramp-up Rate 3 °C/Second Max - Temperature (TL) (Liquidus) +217 °C Reflow - Time (min to max) (TL) 60 -150 Seconds Peak Temperature (TP) 260 +0/-5 °C Time within 5 °C of actual peak Temperature (TP) 20-40 Seconds Ramp-down Rate 6 °C/Second Max Time 25 °C to peak Temperature (T P) 8 minutes Max Note that this product will be easily damaged by rapid heating, rapid cooling or local heating. Do not give heat shock over 100 °C in the process of soldering. We recommend to take preheating and gradual cooling Soldering gun procedure Note the follows, in case of using solder gun for replacement. 1) The tip temperature must be less than 280 for the period within 3 seconds by using soldering gun under 30W 2) The soldering gun tip shall not touch this product directly. Soldering volume Note that excess of soldering volume will easily get crack the body of this product. Core Material: Iron End termination: Ni / Sn Unit: mm L W T E Do not exceed to bend the board after soldering this product extremely. (reference examples) l Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board. l Do not bend extremely the board, in mounting another component. If necessary, use back-up pin (support pin) to prevent from bending extremely. l Do not break the board by hand. We recommend to use the machine or the jig to break it. 2.0 ±0.2 1.6 ±0.2 1.0 Max 0.5 ±0.3 A B C 0.9 2.0 1.6 Unit: mm Soldering Parameters Precaution for Soldering Ramp-down Preheat Critical Zone TL to TP Time to peak temperature (t 25℃ to peak) TP TL TS(max) TS(min) 25 Ramp-up Time Construction & Dimensions Precaution for Handling of Substrate Recommended Pad Layout L T E E W |
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