69

®

NIC COMPONENTS CORP.

Stacked Film Capacitor Chips

NSPU Series

STANDARD VALUES AND CASE SIZES (mm)

TAPE AND REEL DIMENSIONS (mm)

t

1.75 ±0.1

W

1.5 +0.1

-0

4.0 ±0.1

P

1

F

A

D

o

B

C

P

LAND PATTERN DIMENSIONS (mm)

13.0

+/−

0.5

D2

REEL

W

2.0 +/- 0.5

2.0

+/− 0.5

t

A

B

Stacked Element Terminations:

L

1

H

W

p

p

L

2

95.5% Sn, 4% Ag and

0.5% Cu over phenolic

resin/Ag/Ni/Cu barrier over

Cu base.

EIA Size

A ± 0.1

B ± 0.1

C ± 0.2

0805

1.55

2.3

1.3

1206

1.9

3.5

1.5

1210

1.9

3.5

1.9

Part Number

Capacitance Value

Dimensions (mm)

EIA

Size

Reel

Qty

L ± 0.2

W ± 0.2

H ± 0.2

P

NSPU104M16TRA3F

0.1

μF

2.0

1.25

1.0

0.45 ± 0.25

0805

3,000

NSPU154M16TRB4F

0.15

μF

3.2

1.6

0.8

0.65 ± 0.30

1206

3,000

NSPU224M16TRB4F

0.22

μF

0.8

1206

3,000

NSPU334M16TRB5F

0.33

μF

1.0

1206

3,000

NSPU474M16TRB6F

0.47

μF

1.4

1206

2,000

NSPU684M16TRB6F

0.68

μF

1.4

1206

2,000

NSPU105M16TRC4F

1.0

μF

2.5

1.4

1210

2,000

Case Code

A ± 0.1

B ± 0.1

C ± 0.2

t ± 0.05

W ± 0.3

F ± 0.05

P ± 0.1

D +0.2/-0

A3

1.55

2.3

1.3

0.25

8.0

3.5

4.0

1.0

B4, B5

1.9

3.5

1.5

B6

1.9

3.5

1.9

C4

2.8

3.5

1.9

RECOMMENDED REFLOW PROFILE

Peak Temperature

240°C

50

100

150

200

250

300

Time

Pre-heat

150°C ~ 180°C

120 sec. max.

25

0

Cool Down

Time above 220°C

30 sec. max.

Ramp-up

25°C ~ 150°C

90 sec. max.

Note: These capacitors are sensitive to moisture. Capacitors should be stored in moisture barrier packaging at

+25°C and a relative humidity of <70% (six months maximum). The components should be soldered within 72

hours of breaking the moisture barrier packaging seal and stored during those 72 hours at <+25°C and <70%

relative humidity. If the parts are to be storage outside of the moisture barrier packaging the conditions should

be <+20°C and relative humidity of less then 50%.