1

®

NIC COMPONENTS CORP. www.niccomp.com

www.lowESR.com

www.RFpassives.com

www.SMTmagnetics.com

SPECIFICATIONS ARE SUBJECT TO CHANGE

Stacked Film Capacitor Chips

NSWC Series

FEATURES

• STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM

• STANDARD EIA 1206, 1210, 1913, 2416, 2820, 3022 AND 3925 SIZES

• HIGH HEAT AND MOISTURE RESISTANT

• VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS

• REFLOW SOLDERING ONLY

• TAPE AND REEL PACKAGING

ENVIRONMENTAL CHARACTERISTICS

RECOMMENDED LAND

PATTERN (mm)

A

B

NSWC IS

RECOMMENDED

FOR NEW DESIGNS

SPECIFICATIONS

Case Sizes

1206

1210

1913

2416

2820

3022

3925

Capacitance Range

0.001 ~ 0.0047

μF 0.0056 ~ 0.01μF 0.012 ~ 0.082μF 0.1 ~ 0.15μF 0.18 ~ 0.33μF 0.39 ~ 0.47μF 0.56 ~ 1.0μF

Votage Ratings

100Vdc

Capacitance Tolerance

0.001 ~ 0.01

μF 5% (J) only,

0.012 ~ 0.15

μF 5% (J) or 10% (K), 0.18 ~ 1.0μF 10% (K) only

Temperature Range

-55°C ~ +105°C (0.001

μF ~ 0.01μF)

-55°C ~ +125°C (0.012

μF ~ 1.0μF with derating above +85°C)

Dissipation factor (20°C)

1.0% max. @ 1KHz

Insulation resistance (20°C)

3 Gigohms or 1000

Ω/F whichever is lower

Dielectric Withstanding

Voltage

150% of Rated Voltage 60 Seconds

Life Test At +105°C

1,000 Hours at 125% of Rated Voltage

(125°C for 0.012

μF ~ 1.0μF)

Capacitance Change

Within +1%/-6% of Initial Value

Dissipation Factor

1.1% Maximum

Insulation Resistance

1 Gigohm Minimum or 300

Ω/F whichever is lower

Resistance to Soldering Heat:

+240°C Peak

Capacitance Change

Within ±5% for 0.012 ~ 1.0

μF or ±3% for 0.001 ~ 0.01μF of initial value

Dissipation Factor

1.1% Max. for 0.012 ~ 1.0

μF or 0.66% Max. for 0.001 ~ 0.01μF

Insulation Resistance

1 Gigohm Minimum or 300

Ω/F whichever is lower

Humidity Load Life (90% ~ 95% RH)

(1) 1,000 Hours, +40°C

500 Hours for 0.012

μF ~ 1.0μF

(2) 500 Hours, +60°C

for 0.001 ~ 0.01

μF

Capacitance Change

(1) +8%/-5%

(2) ±10% of Initial Value

Dissipation Factor

(1) 1.5% Max.

(2) 2.0% Max.

Insulation Resistance

(1) 100 Megohm Min. or 30

Ω/F

(2) 10 Megohm Min. or 3

Ω/F

whichever is lower

Solderability with

25% Wt Rosin-Methanol Flux

90% Minimum Coverage After 2.5 Second Dip Into 245°C Solder Pot

EIA Size

A

B

C

1206

1.8

3.6

1.4

1210

1.8

3.6

2.3

1913

2.6

6.6

3.0

2416

3.8

7.8

3.8

2820

4.5

9.0

4.6

3022

5.1

9.7

5.0

3925

7.2

11.9

5.7

NSWC 823 J 100 TR D4 N F

RoHS Compliant

Optional High Temp. Reflow (+250°C)*

Size Code

Tape & Reel

Voltage

Tolerance Code: J = ±5%

Capacitance in pF, 1st two digits are

significant, 3rd digit is no. of zeros

Series

PART NUMBER SYSTEM

*Special packaging and handling required.

RECOMMENDED REFLOW PROFILE

Standard: +240 °C Peak Temperature

+250°C Special Order

(see part numbering system)

50

100

150

200

250

300

Time

Pre-heat

150°C ~ 180°C

120 sec. max.

25

0

Cool Down

Time above 220°C

60 sec. max.

Ramp-up

25°C ~ 150°C

90 sec. max.

*See Part Number System for Details

RoHS

Compliant

includes all homogeneous materials