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MXC7-PW50-0000 Datasheet(PDF) 6 Page - List of Unclassifed Manufacturers |
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MXC7-PW50-0000 Datasheet(HTML) 6 Page - List of Unclassifed Manufacturers |
6 / 26 page LUXEON35352DDatasheetDS20420140327©2014PhilipsLumiledsLightingCompany. 5 Reflow Soldering Characteristics Table 6. Reflow Profile in Accordance with J-Std-020D. Profile Feature Lead Free Assembly Preheat/Soak: TemperatureMin(T smin) TemperatureMax(T smax) MaximumTime(t s)fromTsmintoTsmax 150°C 200°C 120seconds Ramp-upRate(T LtoTp) 3°C/second LiquidousTemperature(T L) 217°C MaximumTime(t L)MaintainedaboveTL 150seconds MaximumPeakPackageBodyTemperature(T p) 260°C Time(t p)within5°Cofthespecifiedtemperature(Tc) 10-30seconds MaximumRamp-DownRate(T ptoTL) 6°C/second MaximumTime25°CtoPeakTemperature 8minutes Note for Table 6: 1. AlltemperaturesrefertotheapplicationPrintedCircuitBoard(PCB),measuredonthesurfaceadjacenttothepackagebody. 0 50 100 150 200 250 300 050 100 150 200 250 300 Time (seconds) TL: 217°C 255°C +5/-0°C 260°C +0/-5°C ts: 60-120sec. tL: 60-150 sec,max tp: 10-30sec. 30sec max. Tsmin: 150°C Ramp-Up Rate, 3°C/sec. max. Tsmax:200°C Tp: 260°C Temperature profile for Table 6. |
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