NICHIA STS-DA1-2382 <Cat.No.120330>

5

SOLDERING

• Recommended Hand Soldering Condition

Temperature

350°C Max

Soldering Time

3sec Max

Position

No closer than 3mm from

the base of the lens.

• Recommended Dip Soldering Condition

Pre-Heat

120°C Max

Pre-Heat Time

60sec Max

Solder Bath

Temperature

260°C Max

Dipping Time

10sec Max

Dipping Position

No closer than 3mm from

the base of the lens.

* For a better thermal performance, copper alloy is used for the leadframe of the product.

Care must be taken for the soldering conditions and handling of the products after soldering.

* Solder the LED no closer than 3mm from the base of the lens.

Soldering beyond the base of the tie bar is recommended.

* Dip soldering/hand soldering must not be performed more than once.

* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.

* When soldering, do not apply stress to the lead frame while the LED is hot.

* After soldering, the LED position must not be corrected.

* After soldering, NO mechanical shock or vibration should be applied to LED lens

until the LEDs cool down to room temperature.

* In order to avoid damage on the lens during cutting and clinching the leads,

it is not recommended to solder the LEDs directly on customer PCB without any gap between the lens and the board.

If it is unavoidable, customer is advised to check whether such soldering will not cause wire breakage or lens damage.

Direct soldering to double-sided PCBs must be avoided due to an increased effect of heat on the lens.

* When it is necessary to clamp the LEDs to prevent soldering failure,

it is important to minimize the mechanical stress on the LEDs.

* Cut the LED lead frames at room temperature. Cutting the lead frames at high temperature may cause failure of the LEDs.