industrial.panasonic.com/ac/e/

AXK(5/6)F

ACCTB23E 201303-T

NOTES

1. As shown below, excess force

during insertion may result in damage

to the connector or removal of the

solder. Also, to prevent connector

damage please confirm the correct

position before mating connectors.

2. Keep the PC board warp no more

than 0.03 mm in relation to the overall

length of the connector.

3. Recommended PC board and metal

mask patterns

Connectors are mounted with high pitch

density, intervals of 0.35 mm, 0.4 mm or

0.5 mm.

In order to reduce solder and flux rise,

solder bridges and other issues make

sure the proper levels of solder is used.

The figures to the right are recommended

metal mask patterns. Please use them as

a reference.

• Socket

Recommended PC board pattern

(TOP VIEW)

Recommended metal mask pattern

Metal mask thickness: When 150

µm

(Opening area ratio: 56%)

Recommended metal mask pattern

Metal mask thickness: When 120

µm

(Opening area ratio: 69%)

• Header

Recommended PC board pattern

(TOP VIEW)

Recommended metal mask pattern

Metal mask thickness: When 150

µm

(Opening area ratio: 58%)

Recommended metal mask pattern

Metal mask thickness: When 120

µm

(Opening area ratio: 72%)

Max. 0.03mm

Max. 0.03mm

B

±0.05

0.25

±0.05

0.125

±0.05

0.30

±0.05

0.50

±0.05

0.50

±0.05

0.23

±0.01

0.50

±0.01

0.50

±0.01

B

±0.01

0.50

±0.01

0.50

±0.01

0.23

±0.01

B

±0.01

0.125

±0.05

0.30

±0.05

B

±0.05

0.25

±0.05

0.50

±0.05

0.50

±0.05

0.23

±0.01

0.50

±0.01

0.50

±0.01

B

±0.01

0.50

±0.01

0.50

±0.01

0.23

±0.01

B

±0.01

* See the dimension table on page 85 for more information on the B dimension of the socket and header.

Please refer to the latest product

specifications when designing your

product.