1–4

Chapter 1: Cyclone III Device Family Overview

Cyclone III Device Family Features

Cyclone III Device Handbook

July 2012

Altera Corporation

Volume 1

Table 1–2 lists Cyclone III device family package options, I/O pins, and differential

channel counts.

Table 1–2. Cyclone III Device Family Package Options, I/O pin and Differential Channel Counts (1), (2), (3), (4), (5)

Family

Package

E144 (7)

M164

P240

F256

U256

F324

F484

U484

F780

Cyclone III

(8)

EP3C5

94, 22

106, 28

—

182, 68

182, 68

—

—

—

—

EP3C10

94, 22

106, 28

—

182, 68

182, 68

—

—

—

—

EP3C16

84, 19

92, 23

160, 47 168, 55

168, 55

—

346, 140

346, 140

—

EP3C25

82, 18

—

148, 43 156, 54

156, 54

215, 83

—

—

—

EP3C40

—

—

128, 26

—

—

195, 61

331, 127

331, 127

535, 227 (6)

EP3C55

—

—

—

—

—

—

327, 135

327, 135

377, 163

EP3C80

—

—

—

—

—

—

295, 113

295, 113

429, 181

EP3C120

—

—

—

—

—

—

283, 106

—

531, 233

Cyclone III

LS

EP3CLS70

—

—

—

—

—

—

294, 113

294, 113

429, 181

EP3CLS100

—

—

—

—

—

—

294, 113

294, 113

429, 181

EP3CLS150

—

—

—

—

—

—

226, 87

—

429, 181

EP3CLS200

—

—

—

—

—

—

226, 87

—

429, 181

Notes to Table 1–2:

(1) For each device package, the first number indicates the number of the I/O pin; the second number indicates the differential channel count.

(2) For more information about device packaging specifications, refer to the Cyclone III Package and Thermal Resistance webpage.

(3) The I/O pin numbers are the maximum I/O counts (including clock input pins) supported by the device package combination and can be affected

by the configuration scheme selected for the device.

(4) All packages are available in lead-free and leaded options.

(5) Vertical migration is not supported between Cyclone III and Cyclone III LS devices.

(6) The EP3C40 device in the F780 package supports restricted vertical migration. Maximum user I/Os are restricted to 510 I/Os if you enable

migration to the EP3C120 and are using voltage referenced I/O standards. If you are not using voltage referenced I/O standards, you can increase

the maximum number of I/Os.

(7) The E144 package has an exposed pad at the bottom of the package. This exposed pad is a ground pad that must be connected to the ground

plane on your PCB. Use this exposed pad for electrical connectivity and not for thermal purposes.

(8) All Cyclone III device UBGA packages are supported by the Quartus II software version 7.1 SP1 and later, with the exception of the UBGA

packages of EP3C16, which are supported by the Quartus II software version 7.2.