CYStech Electronics Corp.

Spec. No. : C467FP

Issued Date : 2009.03.19

Revised Date : 2009.10.23

Page No. : 4/4

MBR10120FP

CYStek Product Specification

TO-220FP Dimension

*: Typical

Style: Pin

1.Anode 2.Cathode 3.Anode

1 2

3

Marking:

A K A

Date Code

Device

Name

3-Lead TO-220FP Plastic Package

CYStek Package Code: FP

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.3740

0.4134

9.50

10.50

E2

0.0984

0.1063

2.50

2.70

A1

*0.2756

*7.00

N1

0.0961

0.1039

2.44

2.64

B

0.6063

0.6299

15.40

16.00

N2

0.1921

0.2079

4.88

5.28

b1

0.2480

0.2717

6.30

6.90

P

0.0984

0.1142

2.50

2.90

b2

0.0984

0.1181

2.50

3.00

L

0.5276

0.5354

13.40

13.60

C

0.0138

0.0295

0.35

0.75

L1

0.1378

0.1772

3.50

4.50

D

0.0276

0.0354

0.70

0.90

I

0.1181

0.1339

3.00

3.40

D1

0.0394

0.0551

1.00

1.40

T

0.0059

0.0138

0.15

0.35

E1

0.1693

0.1850

4.30

4.70

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: KFC ; tin plated

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.