MLEAMB-A1-0000-000X01 datasheet(1/26 Pages) CREE

Part #	MLEAMB-A1-0000-000X01

Description	Available in white (2600 K to 8300 K CCT), 80-, 85- and 90?멌RI minimum

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Manufacturer	CREE [Cree, Inc]

Direct Link	http://www.cree.com/

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Product family data sheet

Cree logo and XLamp® are registered trademarks of Cree, Inc.

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

cree

® Xlamp® ml-e leds

Product descriPtion

The Cree XLamp mL-e LeD brings

lighting-class

reliability

and

performance to ½-watt LeDs.

The XLamp mL-e expands Cree’s

lighting-class leadership to LeD

bulbs and linear and distributed

lighting applications. with XLamp

lighting-class reliability, a wide

viewing

angle,

uniform

light

output,

and

industry-leading

chromaticity binning in a 3.5-mm

X 3.5-mm package, the XLamp

mL-e LeD continues Cree’s history

of

segment-focused

product

innovation in LeDs for lighting

applications.

The XLamp mL-e LeD brings high

performance and a smooth look to a

wide range of lighting applications,

including linear lighting, LeD light

bulbs, fluorescent retrofits and

retail-display lighting.

features

• Available in white (2600 K to

8300 K CCT), 80-, 85- and

90-CRI minimum

• Available in royal blue, blue,

green, amber and red

• Available in parallel and series

Vf configurations for white and

color

• ANSI-compatible sub-bins

• Maximum drive current: 500 mA

for parallel white, 167 mA for

series white, 350 mA for parallel

royal blue, blue, green and

red, 250 mA for parallel amber,

120 mA for series blue and

green, 65 mA for series amber,

88 mA for series red

• 120° viewing angle for white,

125° viewing angle for color

• Uniform chromaticity profile

• Electrically neutral thermal path

• RoHS- and REACh-compliant

• UL-recognized component

(E349212)

table of contents

Characteristics ............................ 2

Flux Characteristics...................... 3

Relative Spectral power

Distribution................................. 7

Relative Luminous Flux vs.

Junction Temperature................... 8

Relative Radiant Flux vs. Junction

Temperature ............................... 9

electrical Characteristics..............10

Relative Luminous Flux vs.

Current .....................................12

Relative Radiant Flux vs. Current ..14

Typical Spatial Distribution...........14

Thermal Design..........................16

Reflow Soldering Characteristics ...21

Notes........................................22

mechanical Dimensions................24

Tape and Reel ............................25

packaging..................................26

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MLEAMB-A1-0000-000X01 Datasheet(PDF) 1 Page - Cree, Inc

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