Product family data sheet

cree

Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.

Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.

Product descriPtion

performing silicon carbide-based

LeD

technology,

delivered

in

Cree’s

industry-standard

XP/XT

packaging. XT-e White sets the

new standard for high performance

and dramatically lowers system

cost. XT-e Royal Blue is Cree’s

highest performing source of royal

blue light for remote-phosphor

applications.

Cree XLamp LeDs bring high

performance

and

quality

of light to a wide range of

lighting

applications,

including

remote-phosphor, color-changing,

portable and personal, outdoor,

indoor-directional, transportation,

stage and studio, commercial and

emergency-vehicle lighting.

features

• Available in white, 80-CRI min

white, 70-CRI min white and

royal blue

• Warm white available in 85- and

90-CRI min.

• New: available in 2200 K CCT

• Binned at 85 °C

• Coolwhiteefficacyofupto

148 lm/W (@ 85 °C, 350 mA)

• RoyalBluewallplugefficiencyof

up to 53% (@ 85 °C, 350 mA)

• Wide viewing angle: 115-140°

• Thermal resistance: 5 °C/W

• Maximum drive current: 1.5 A

• electrically neutral thermal path

• vf binning supported for XT-e

White and Royal Blue

• XT-e Royal Blue sorted into

2.5-nm wavelength bins

• Unlimitedfloorlifeat

≤30ºC/85%RH

• Reflowsolderable-JEDEC

J-STD-020Ccompatible

• RoHS-andREACh-compliant

• UL-recognized component

(e349212)

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

www.cree.com/xlamp

Copyright © 2011-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

table of contents

Characteristics .......................... 2

Flux Characteristics.................... 3

Relative Spectral Power

Distribution............................... 5

Relative Luminous Flux vs.

JunctionTemperature................. 6

Relative Radiant Flux vs.

JunctionTemperature................. 6

electrical Characteristics............. 7

Relative Luminous Flux vs.

Current .................................... 8

Relative Radiant Flux vs. Current . 8

Relative Chromaticity vs. Current

and Temperature ....................... 9

Typical Spatial Distribution.........10

Thermal Design........................11

ReflowSolderingCharacteristics .12

Notes......................................13

Mechanical Dimensions..............14

Tape and Reel ..........................15

Packaging................................16

note: for remote phosphor applications, a separate license to certain cree patents is required.