industrial.panasonic.com/ac/e/

AYF32

ACCTB8E 201303-T

• Connector orientation with respect to embossed tape feeding direction

NOTES

Type

Direction

of tape progress

Y3F

1. Recommended PC board and metal

mask patterns

Connectors are mounted with high pitch

density, intervals of 0.3 mm or 0.5 mm.

In order to reduce solder and flux rise,

solder bridges and other issues make

sure the proper levels of solder is used.

The figures to the right are recommended

metal mask patterns. Please use them as

a reference.

Recommended PC board pattern

(mounting layout)

(TOP VIEW)

Recommended metal mask pattern

Metal mask thickness: When 120

µm

(Front terminal portion opening area ratio: 50%)

(Back terminal portion opening area ratio: 51%)

(Soldering terminal portion opening area ratio: 100%)

0.30

±0.03

0.60

±0.03

0.30

±0.03

0.60

±0.03

0.45

±0.03

0.70

±0.03

Area of exposed

soldering terminal

Area of exposed

soldering terminal

0.27

±0.01

0.60

±0.01

0.27

±0.01

0.60

±0.01

0.45

±0.01

0.70

±0.01

Please refer to the latest product

specifications when designing your

product.