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AYF322715 Datasheet(PDF) 4 Page - Panasonic Semiconductor |
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AYF322715 Datasheet(HTML) 4 Page - Panasonic Semiconductor |
4 / 7 page Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ AYF32 ACCTB8E 201303-T • Connector orientation with respect to embossed tape feeding direction NOTES Type Direction of tape progress Y3F 1. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.3 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Recommended PC board pattern (mounting layout) (TOP VIEW) Recommended metal mask pattern Metal mask thickness: When 120 µm (Front terminal portion opening area ratio: 50%) (Back terminal portion opening area ratio: 51%) (Soldering terminal portion opening area ratio: 100%) 0.30 ±0.03 0.60 ±0.03 0.30 ±0.03 0.60 ±0.03 0.45 ±0.03 0.70 ±0.03 Area of exposed soldering terminal Area of exposed soldering terminal 0.27 ±0.01 0.60 ±0.01 0.27 ±0.01 0.60 ±0.01 0.45 ±0.01 0.70 ±0.01 Please refer to the latest product specifications when designing your product. |
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