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EVB-EN5335QI Datasheet(PDF) 11 Page - Altera Corporation |
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EVB-EN5335QI Datasheet(HTML) 11 Page - Altera Corporation |
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11 / 15 page  EN5335QI 11 www.altera.com/enpirion Layout Recommendation Figure 4 shows critical components and layer 1 traces of a recommended minimum footprint EN5335QI layout. Alternate ENABLE configurations and other small signal pins need to be connected and routed according to specific customer application. Please see the Gerber files on the Altera website www.altera.com/enpirion for exact dimensions and other layers. Please refer to Figure 4 while reading the layout recommendations in this section. Recommendation 1: Input and output filter capacitors should be placed on the same side of the PCB, and as close to the EN5335QI package as possible. They should be connected to the device with very short and wide traces. Do not use thermal reliefs or spokes when connecting the capacitor pads to the respective nodes. The +V and GND traces between the capacitors and the EN5335QI should be as close to each other as possible so that the gap between the two nodes is minimized, even under the capacitors. Recommendation 2: Two PGND pins are dedicated to the input circuit, and two to the output circuit. The slit in Figure 4 separating the input and output GND circuits helps minimize noise coupling between the converter input and output switching loops. Recommendation 3: The system ground plane should be the first layer immediately below the surface layer. This ground plane should be continuous and un-interrupted below the converter and the input/output capacitors. Please see the Gerber files on the Altera website www.altera.com/enpirion. Recommendation 4 : The large thermal pad underneath the component must be connected to the system ground plane through as many vias as possible. Figure 4: Top PCB Layer Critical Components and Copper for Minimum Footprint The drill diameter of the vias should be 0.33mm, and the vias must have at least 1 oz. copper plating on the inside wall, making the finished hole size around 0.20-0.26mm. Do not use thermal reliefs or spokes to connect the vias to the ground plane. This connection provides the path for heat dissipation from the converter. Please see Figures: 7, 8, and 9. Recommendation 5 : Multiple small vias (the same size as the thermal vias discussed in recommendation 4 should be used to connect ground terminal of the input capacitor and output capacitors to the system ground plane. It is preferred to put these vias under the capacitors along the edge of the GND copper closest to the +V copper. Please see Figure 4. These vias connect the input/output filter capacitors to the GND plane, and help reduce parasitic inductances in the input and output current loops. If the vias cannot be placed under CIN and COUT, then put them just outside the capacitors along the GND slit separating the two components. Do not use thermal reliefs or spokes to connect these vias to the ground plane. Recommendation 6 : AVIN is the power supply for the internal small-signal control circuits. It should be connected to the input voltage at a quiet point. In Figure 4 this connection is made at 00846 October 11, 2013 Rev J |
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