PBSS4021PZ_1

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© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 01 — 31 March 2010

11 of 15

NXP Semiconductors

PBSS4021PZ

11. Soldering

Fig 16. Reflow soldering footprint SOT223 (SC-73)

Fig 17. Wave soldering footprint SOT223 (SC-73)

sot223_fr

1.2

(4

×)

1.2

(3

×)

1.3

(4

×)

1.3

(3

×)

6.15

7

3.85

3.6

3.5

0.3

3.9

7.65

2.3

2.3

6.1

4

23

1

solder lands

solder resist

occupied area

solder paste

Dimensions in mm

sot223_fw

1.9

6.7

8.9

8.7

1.9

(3

×)

1.9

(2

×)

1.1

6.2

2.7

2.7

2

4

3

1

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm