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SP43503 Datasheet(PDF) 4 Page - SIPAT Co,Ltd |
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SP43503 Datasheet(HTML) 4 Page - SIPAT Co,Ltd |
4 / 10 page Product Specification SP43503 Page 4 of 10 0 5 10 15 20 25 30 1.0E+03 1.0E+04 1.0E+05 1.0E+06 1.0E+07 1.0E+08 1.0E+09 Hz 1 2 3 4 5 6 18 17 16 15 14 13 24 23 22 21 20 19 7 8 9 101112 GND C1 C2 C4 C8 C16 NC VDD P/S GND RF1 GND SI CLK LE GND RF2 GND Exposed Solder Pad Table 2. Pin Descriptions Figure 13. Pin Configuration (Top View) Pin No. Pin Name Description 1 NC No Connect 2 VDD Power supply pin 3 P̅/S Serial/Parallel mode select 4 GND Ground 5 RF1 RF1 port 6 GND Ground 7 - 12 GND Ground 13 GND Ground 14 RF2 RF2 port 15 GND Ground 16 LE Serial interface Latch Enable input 17 CLK Serial interface Clock input 18 SI Serial interface Data input 19 C16 (D6) Parallel control bit, 16 dB 20 C8 (D5) Parallel control bit, 8 dB 21 C4 (D4) Parallel control bit, 4 dB 22 C2 (D3) Parallel control bit, 2 dB 23 C1 (D2) Parallel control bit, 1 dB 24 GND Ground Note: Ground C1, C2, C4, C8, C16 if not in use. Electrostatic Discharge (ESD) Precautions When handling this CMOS device, observe the same precautions that you would use with other ESD- sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the specified rating. Exposed Solder Pad Connection The exposed solder pad on the bottom of the package must be grounded for proper device operation. Latch-Up Avoidance Unlike conventional CMOS devices, CMOS devices are immune to latch-up. Switching Frequency The SP43503 has a maximum 25 kHz switching rate. Switching rate is defined to be the speed at which the DSA can be toggled across attenuation states. Exceeding absolute maximum ratings may cause permanent damage. Operation should be restricted to the limits in the Operating Ranges table. Operation between operating range maximum and absolute maximum for extended periods may reduce reliability. Moisture Sensitivity Level The Moisture Sensitivity Level rating for the SP43503 in the 24-lead 4x4 QFN package is MSL1. Note: 1. Human Body Model (HBM, MIL_STD 883 Method 3015.7) Figure 14. Maximum Power Handling Capability Table 3. Operating Ranges Table 4. Absolute Maximum Ratings Symbol Parameter/Conditions Min Max Units VDD Power supply voltage -0.3 6.0 V VI Voltage on any Digital input -0.3 5.8 V TST Storage temperature range -65 150 °C PIN Input power (50 Ω) 9 kHz ≤ 20 MHz 20 MHz ≤ 6 GHz Fig. 14 +23 dBm dBm VESD ESD voltage (HBM)1 ESD voltage (Machine Model) 500 100 V V Parameter Min Typ Max Units VDD Power Supply Voltage 3.0 3.3 V IDD Power Supply Current 70 350 µA Digital Input High 2.6 5.5 V PIN Input power (50Ω): 9 kHz ≤ 20 MHz 20 MHz ≤ 6 GHz Fig. 14 +23 dBm dBm TOP Operating temperature range -40 25 85 °C Digital Input Low 0 1 V Digital Input Leakage1 15 µA VDD Power Supply Voltage 5.0 5.5 V Note 1. Input leakage current per Control pin Tel: +86-23-62808818 Fax: +86-23-62805284 www.sipatsaw.com / sawmkt@sipat.com |
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