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211X1-DSH-001-I Datasheet(PDF) 11 Page - M/A-COM Technology Solutions, Inc. |
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211X1-DSH-001-I Datasheet(HTML) 11 Page - M/A-COM Technology Solutions, Inc. |
11 / 65 page 211x1-DSH-001-I Mindspeed Technologies ® 11 Mindspeed Proprietary and Confidential 2.0 Package Outline Drawing and Pin Descriptions 2.1 Package Outline Drawing 2.1.1 M21131 and M21151 Packaging Drawing (-12/-13/-14) Figure 2-1 illustrates the M21131/M21151 (-12/-13/-14) overall package dimensions and a cross sectional view, Figure 2-2 is a bottom view of the package with ball assignments. The substrate thickness is 2.03 millimeters. All dimensions are in millimeters. The ball count is 1156, the width of each ball is 0.60 millimeters, and the ball pitch from center to center is 1.00 millimeters. Figure 2-1. M21131/M21151 (-12/-13/-14) Package Outline Top View and Cross Sectional View (in mm) (heat spreader) |
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