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02016-DSH-001-G Datasheet(PDF) 2 Page - M/A-COM Technology Solutions, Inc. |
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02016-DSH-001-G Datasheet(HTML) 2 Page - M/A-COM Technology Solutions, Inc. |
2 / 19 page 02016-DSH-001-G Mindspeed Technologies ® ii Mindspeed Proprietary and Confidential Ordering Information Part Number Package Operating Temperature M02016-xx* Waffle Pack –40°C to 85°C M02016-xx* Expanded whole wafer on a ring –40°C to 85°C NOTE: *xx represents the revision number. Please contact your local sales office for correct digits. Revision History Revision Level Date Description G Released August 2007 Corrected PinA, AGC, and DOUT absolute maximum voltage in Table 1-1. Removed Imon graph from the Typical Performance graphs (Chapter 1.6). F Released June 2007 Revised Table 1-1 Separate Applications Information from Functional Description. Add notes to clarify the bonding procedure. E Released November 2004 Production Release. Typical Eye Diagram Eye Diagram for 1.25 Gbps at -27 dBm Input Signal Pad Configuration MON PINA PINK V CC AGC DOUT GND GND DOUTGND 1 2 3 4 56 7 8 9 10 11 12 V CC DOUT DOUTGND Die size ≈ 1090 x 880 µm |
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