BFY90 datasheet(1/2 Pages) CENTRAL

Part #	BFY90

Description	NPN - RF Transistor Chip

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Manufacturer	CENTRAL [Central Semiconductor Corp]

Direct Link	http://www.centralsemi.com

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GEOMETRY

PROCESS DETAILS

PRINCIPAL DEVICE TYPES

CMPT918

2N918

2N2857

2N5179

2N5770

BFY90

PN3563

PN3564

GROSS DIE PER 4 INCH WAFER

53,788

PROCESS CP317V

Small Signal Transistor

NPN - RF Transistor Chip

Process

EPITAXIAL PLANAR

Die Size

14.5 x 14.5 MILS

Die Thickness

7.1 MILS

Base Bonding Pad Area

2.4 x 2.2 MILS

Emitter Bonding Pad Area

2.4 x 2.2 MILS

Top Side Metalization

Al - 30,000Å

Back Side Metalization

Au - 18,000Å

www.centralsemi.com

R0 (30-August 2011)

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