CYStech Electronics Corp.

Spec. No. : C194LD

Issued Date : 2012.12.11

Revised Date : 2013.05.03

Page No. : 3/3

SF51G thru SF58G

CYStek Product Specification

DO-201AD Dimension

DO-201AD Molded Plastic Package

CYStek Package Code: LD

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

ϕ0.048

ϕ0.052

ϕ1.20

ϕ1.30

D

1.000

-

25.40

-

B

1.000

-

25.40

-

E

ϕ0.197 ϕ0.220

ϕ5.00

ϕ5.60

C

0.285

0.375

7.20

9.50

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material :

• Lead : Axial leads, solderable per MIL-STD-750, Method 2026 guaranteed.

• Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.