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TL432K3-A-BK-G Datasheet(PDF) 11 Page - Cystech Electonics Corp. |
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TL432K3-A-BK-G Datasheet(HTML) 11 Page - Cystech Electonics Corp. |
11 / 15 page CYStech Electronics Corp. Spec. No. : C504A3 Issued Date : 2003.03.21 Revised Date : 2013.10.23 Page No. : 11/15 TL432A3/N3/M3/K3 CYStek Product Specification TO-92L Taping Outline Millimeters DIM Item Min. Max. A1 Component body width 4.70 5.10 A Component body height 7.80 8.20 T Component body thickness 3.70 4.10 d Lead wire diameter 0.40 0.50 d1 Lead wire diameter 1 0.62 0.78 P Pitch of component 12.40 13.00 P0 Feed hole pitch 12.50 12.90 P2 Hole center to component center 6.05 6.65 F1, F2 Lead to lead distance 2.20 2.80 △h Component alignment, F-R -1.00 1.00 W Tape width 17.50 19.00 W0 Hole down tape width 5.50 6.50 W1 Hole position 8.50 9.50 W2 Hole down tape position - 1.00 H Height of component from tape center 19.00 21.00 H0 Lead wire clinch height 15.50 16.50 L1 Lead wire (tape portion) 2.50 - D0 Feed hole diameter 3.80 4.20 t1 Taped lead thickness 0.35 0.45 t2 Carrier tape thickness 0.15 0.25 P1 Position of hole 3.55 4.15 △P Component alignment -1.00 1.00 |
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