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PMF4218TS Datasheet(PDF) 2 Page - Ericsson |
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PMF4218TS Datasheet(HTML) 2 Page - Ericsson |
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2 / 29 page  Ericsson Internal PRODUCT SPECIFICATION 2 (3) Prepared (also subject responsible if other) No. Henrik Sundh (MPM/BY/P) 1/1301 BMR 643 4 Uen Approved Checked Date Rev Reference MPM/BY/M [Krister Lundberg] 2006-02-20 A General Information Ordering Information See Contents for individual product ordering numbers. Option Suffix Through hole pin SMD pin SMD pin, leadfree reflow temperature capable P S R PMF4218TP PMF4218TS PMF4218TSR Reliability The Mean Time Between Failure (MTBF) is calculated at full output power and an operating ambient temperature (T A) of +40°C. Different methods could be used to calculate the predicted MTBF and failure rate which may give different results. Ericsson Power Modules currently uses Telcordia SR332. Predicted MTBF for the series is: - 4.04 million hours according to Telcordia SR332, issue 1, Black box technique. Telcordia SR332 is a commonly used standard method intended for reliability calculations in IT&T equipment. The parts count procedure used in this method was originally modelled on the methods from MIL-HDBK-217F, Reliability Predictions of Electronic Equipment. It assumes that no reliability data is available on the actual units and devices for which the predictions are to be made, i.e. all predictions are based on generic reliability parameters. Compatibility with RoHS requirements) The products are compatible with the relevant clauses and requirements of the RoHS directive 2002/95/EC and have a maximum concentration value of 0.1% by weight in homogeneous materials for lead in other applications other than lead in solder, lead in high melting temperature type solder, lead in glass of electronics components, lead in electronic ceramic parts and lead as an alloying element in copper containing up to 4% lead by weight, mercury, hexavalent chromium, PBB and PBDE and of 0.01% by weight in homogeneous materials for cadmium. Exemptions in the RoHS directive utilized in the products: - Lead as an alloying element in copper alloy containing up to 4% lead by weight (used in connection pins made of Brass) - Lead in high melting temperature type solder (used to solder the die in semiconductor packages) - Lead in glass of electronics components and in electronic ceramic parts (e.g. fill material in chip resistors) - Lead in solder for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunication (Note: the products are manufactured in lead-free soldering processes and the lead present is only located in the terminal plating finishes on some components) Quality Statement The products are designed and manufactured in an industrial environment where quality systems and methods like ISO 9000, 6σ (sigma), and SPC are intensively in use to boost the continuous improvements strategy. Infant mortality or early failures in the products are screened out and they are subjected to an ATE-based final test. Conservative design rules, design reviews and product qualifications, plus the high competence of an engaged work force, contribute to the high quality of our products. Warranty Warranty period and conditions are defined in Ericsson Power Modules General Terms and Conditions of Sale. Limitation of Liability Ericsson power Modules does not make any other warranties, expressed or implied including any warranty of merchantability or fitness for a particular purpose (including, but not limited to, use in life support applications, where malfunctions of product can cause injury to a person’s health or life). E PMF 4000 series POL regulator, Input 2.95-3.65 V, Output 10 A/25 W EN/LZT 146 316 R1B February 2006 © Ericsson Power Modules AB Technical Specification E PMF 4000 series POL regulator, Input 2.95-3.65 V, Output 10 A/25 W EN/LZT 146 316 R1B April 2006 © Ericsson Power Modules AB Technical Specification E PMF 4000 series POL regulator, Input 2.95-3.65 V, Output 10 A/25 W EN/LZT 146 316 R1C Aug 2007 © Ericsson Power Modules AB Technical Specification 2 |
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