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MP03XX260 Datasheet(PDF) 3 Page - Dynex Semiconductor |
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MP03XX260 Datasheet(HTML) 3 Page - Dynex Semiconductor |
3 / 9 page MP03 XX 260 Series 3/9 Part number is made up as follows: MP03 HB 260 - 16 MP = Pressure contact module 03 = Outline type HB = Circuit configuration code (see "circuit options" - front page) 260 = Nominal average current rating at T case = 75 oC 16 = V RRM/100 Examples: MP03 HB260-10 MP03 G260-14 MP023GN260-12 Note: Preferred type is HB configuration. G & GN types are available for specific applications, only when requested. Adequate heatsinking is required to maintain the base temperature at 75 oC if full rated current is to be achieved. Power dissipation may be calculated by use of V TO and rT information in accordance with standard formulae. We can provide assistance with calculations or choice of heatsink if required. The heatsink surface must be smooth and flat; a surface finish of N6 (32 µin) and a flatness within 0.05mm (0.002") are recommended. Immediately prior to mounting, the heatsink surface should be lightly scrubbed with fine emery, Scotch Brite or a mild chemical etchant and then cleaned with a solvent to remove oxide build up and foreign material. Care should be taken to ensure no foreign particles remain. An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum thermal performance. After application of thermal compound, place the module squarely over the mounting holes, (or 'T' slots) in the heatsink. Using a torque wrench, slowly tighten the recommended fixing bolts at each end, rotating each in turn no more than 1/4 of a revolution at a time. Continue until the required torque of 5Nm (44lb.ins) is reached at both ends. It is not acceptable to fully tighten one fixing bolt before starting to tighten the others. Such action may DAMAGE the module. ORDERING INSTRUCTIONS MOUNTING RECOMMENDATIONS |
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