PS7622A-2A

RECOMMENDED SOLDERING CONDITIONS

Recommended Temperature Profile of Infrared Reflow

(1) Infrared reflow soldering

•

Peak reflow temperature

235 ˚C (package surface temperature)

•

Time of temperature higher than 210 ˚C

30 seconds or less

•

Number of reflows

Two

•

Flux

Rosin flux containing small amount of chlorine (The flux

with a max. chlorine content of 0.2 Wt % is recommended

(2) Dip soldering

•

Temperature

260 ˚C or below (molten solder temperature)

•

Time

10 seconds or less

•

Number of times

One (Allowed to be dipped in solder including plastic

mold portion.)

•

Flux

Rosin flux containing small amount of chlorine (The flux

with a max. chlorine content of 0.2 Wt % is recommended.)

(3) Cautions

•

Fluxes

Avoid removing the residual flux with freon-based and chlorine-

based cleaning solvent.

Avoid shorting between portion of frame and leads.

Time (s)

100 to 160

60 to 120 s

(preheating)

(heating)

to 10 s

to 30 s

235

210

EXCLUSIVE NORTH AMERICAN AGENT FOR

RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS

CALIFORNIA EASTERN LABORATORIES

• Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279

24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only)

• Internet: http://WWW.CEL.COM

10/30/2001

DATA SUBJECT TO CHANGE WITHOUT NOTICE

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∗ : Portion of frame

Life Support Applications

These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected

to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify

CEL for all damages resulting from such improper use or sale.