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IC500-0644-008 Datasheet(PDF) 1 Page - List of Unclassifed Manufacturers |
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IC500-0644-008 Datasheet(HTML) 1 Page - List of Unclassifed Manufacturers |
1 / 8 page SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER SMT Devices 46 Test Solutions Specifications Insulation Resistance: 1,000M Ω min. at 100V DC Dielectric Withstanding Voltage: for 1 minute (socket depended) Contact Resistance: 30m Ω max. at 10mA/20mV max. Operating Temperature Range: –40°C to +150°C (for type PEI/PSF) –55°C to +170°C (for type PES) –55°C to +170°C (for type PEI) Mating Cycles: 10,000 insertions min. Materials and Finish Housing: Polysulphone (PSF), glass-filled Polyethersulphone (PES), glass-filled Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Series Overview *QFP (Quad Flat Packages, Gullwing Leads) Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD® Part Number (Details) 0.4mm to 1.27 Pitch As specifications for this product differ by pitch and material-mix, please contact our Sales Department for detailed information. Series No. Number of Sides with Contacts No. of Contact Pins Design Number IC51 064 807 4 -- *QFP variations e.g. BQFP... Specifications Insulation Resistance: 1,000M Ω min. at 500V DC, pitch 0.4 to 0.8 Dielectric Withstanding Voltage: 100V AC for 1 minute, pitch 0.5 to 0.8 Contact Resistance: 30m Ω max. at 10mA/20mV max. Operating Temperature Range: –40°C to +150°C Mating Cycles: 10,000 insertions min. Contact Force: 20g to 45g per pin Materials and Finish Housing: Polyetherimide (PEI), glass-filled Polyethersulphone (PES) glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Series IC357 and IC402 (Open Top) Quad Flat Package (QFP) with 2-Point Contact Type 0.4 to 0.8mm Pitch -- Series No. Number of Sides with Contacts No. of Contact Pins Design Number Positioning Pin N=Without Positioning Pin P=With Positioning Pin IC357 100 002 4* Part Number (Details) Specifications Insulation Resistance: 1,000M Ω min. at 100V DC pitch 0.4, 0.5 1,000M Ω min. at 500V DC pitch 0.65, 0.8 Dielectric Withstanding Voltage: 100V AC for 1 minute pitch 0.4, 0.5 500V AC for 1 minute pitch 0.65 700V AC for 1 minute pitch 0.8 Contact Resistance: 30m Ω max. at 10mA/20mV max. Operating Temperature Range: –40°C to +150°C Contact Force: 20g to 80g per pin Mating Cycles: 10,000 insertions min. Materials and Finish Housing: Polyetherimide (PEI), glass-filled Polyethersulphone (PES) glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Series IC234 (Open Top) Quad Flat Package (QFP) with Shoulder Contact Type 0.4 to 0.8mm Pitch Part Number (Details) Series No. Number of Sides with Contacts No. of Contact Pins Design Number Positioning Pin N= Without Positioning Pin P= With Positioning Pin K= Protection Key IC234 120 017 4* -- ** ** Protection Key: Prevents IC from releasing during transportation |
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