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IC201-2084-096 Datasheet(PDF) 2 Page - List of Unclassifed Manufacturers

Part # IC201-2084-096
Description  QFP (Quad Flat Packages, Gullwing Leads)
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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IC201-2084-096 Datasheet(HTML) 2 Page - List of Unclassifed Manufacturers

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SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
SMT Devices
47
Test Solutions
Series Overview
*QFP (Quad Flat Packages, Gullwing Leads)
Specifications
Insulation Resistance:
1,000M
Ω min. at 500V DC or
1,000M
Ω min. at 100V DC
Dielectric Withstanding Voltage: 100/500/700V AC for 1 minute
Contact Resistance:
30m
Ω max. at 10mA/20mV max.
Operating Temperature Range:
–40°C to +170°C and –40°C to +150°C
Contact Force:
20g to 80g per pin
Mating Cycles:
10,000 insertions min.
The information above is typical for this Series
for individual specifications please contact Yamaichi
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Polyphenylenesulfide (PPS), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating:
Gold over Nickel
Series IC200 / IC201 / IC216 / IC217 / IC218 / IC248 (Open Top)
Quad Flat Packages (QFP)
Part Number (Details)
Series No.
Number of Sides
with Contacts
No. of Contact Pins
Design Number
Positioning Pin:
Protection Key**
N= Without Positioning Pin
P= With Positioning Pin
K= With Protection Key
Unmarked = Without Protection Key
IC200
128
001
4*
*
--
-
**Protection Key: Prevents IC from releasing during transportation
0.4 to 0.8mm Pitch
Series IC51
Contact Styles
Series IC (kelvin)
Series IC2**
Series IC234
Series IC357
Series IC500
Specifications
Insulation Resistance:
1,000M
Ω min. at 100V DC pitch 0.5
1,000M
Ω min. at 500V DC pitch 0.65, 0.8
Dielectric Withstanding Voltage: 100V AC for 1 minute pitch 0.5
500V AC for 1 minute pitch 0.65
700V AC for 1 minute pitch 0.8
Contact Resistance:
30m
Ω max. at 10mA/20mV max.
Operating Temperature Range:
–40°C to +150°C
Contact Force:
20g to 80g per pin
Mating Cycles:
10,000 insertions min.
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Polyethersulphone (PES) glass-filled
Contacts: Beryllium Copper (BeCu)
Plating:
Gold over Nickel
Series IC500 (Open Top)
Quad Flat Package (QFP) with 2-Point Contact Type
0.5 to 0.8mm Pitch
Part Number (Details)
Series No.
Number of Sides
with Contacts
No. of Contact Pins
Design Number
Positioning Pin
N=Without PositioningPin
P=With PositioningPin
K= Protection Key
IC500
064
008
4*
--


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