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RBV806D Datasheet(PDF) 1 Page - EIC discrete Semiconductors

Part # RBV806D
Description  SILICON BRIDGE RECTIFIERS
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Manufacturer  EIC [EIC discrete Semiconductors]
Direct Link  http://www.eicsemi.com
Logo EIC - EIC discrete Semiconductors

RBV806D Datasheet(HTML) 1 Page - EIC discrete Semiconductors

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RBV800D - RBV810D
SILICON BRIDGE RECTIFIERS
PRV : 50 - 1000 Volts
Io : 8.0 Amperes
FEATURES :
* High current capability
* High surge current capability
* High reliability
* Low reverse current
* Low forward voltage drop
* High case dielectric strength of 2000 VDC
* Ideal for printed circuit board
* Very good heat dissipation
MECHANICAL DATA :
* Case : Reliable low cost construction
utilizing molded plastic technique
* Epoxy : UL94V-O rate flame retardant
* Terminals : Plated lead solderable per
MIL-STD-202, Method 208 guaranteed
* Polarity : Polarity symbols marked on case
* Mounting position : Any
* Weight : 7.7 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25
°C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
SYMBOL
RBV
800D
RBV
801D
RBV
802D
RBV
804D
RBV
806D
RBV
808D
RBV
810D
UNIT
Maximum Recurrent Peak Reverse Voltage
VRRM
50
100
200
400
600
800
1000
Volts
Maximum RMS Voltage
VRMS
35
70
140
280
420
560
700
Volts
Maximum DC Blocking Voltage
VDC
50
100
200
400
600
800
1000
Volts
Maximum Average Forward Current Tc = 55
°C
IF(AV)
8.0
Amps.
Peak Forward Surge Current Single half sine wave
Superimposed on rated load (JEDEC Method)
IFSM
300
Amps.
Current Squared Time at t < 8.3 ms.
I
2t
166
A
2S
Maximum Forward Voltage per Diode at IF = 8.0 Amps.
VF
1.0
Volts
Maximum DC Reverse Current
Ta = 25
°C
IR
10
µA
at Rated DC Blocking Voltage
Ta = 100
°C
IR(H)
200
µA
Typical Thermal Resistance (Note 1)
R
θJC
2.2
°C/W
Typical Thermal Resistance at Junction to Ambient
R
θJA
15
°C/W
Operating Junction Temperature Range
TJ
- 40 to + 150
°C
Storage Temperature Range
TSTG
- 40 to + 150
°C
Notes :
1. Thermal Resistance from junction to case with units mounted on a 3.2"x3.2"x0.12" THK (8.2cm.x8.2cm.x0.3cm.) Al. Plate. heatsink.
UPDATE : AUGUST 3, 1998
RATING
RBV25
Dimensions in millimeters
C3
4.9 ± 0.2
3.9 ± 0.2
∼∼
∅3.2 ± 0.1
∼∼
0.7 ± 0.1
1.0 ± 0.1
2.0 ± 0.2
30 ± 0.3
7.5
±0.2
10
±0.2
++
7.5
±0.2


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