Bumped GaAs SP3T Switch for WLAN

2.4 - 2.5 GHz

Rev. V4

MASW-008902-000DIE

5

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North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

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India Tel: +91.80.43537383

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China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Die Dimensions (Top and Side Views)

PCB Top Metal / Solder Mask

Die Bump Pad Layout - Bottom View

(bump side down - as installed on board)

Die Bump Pad Layout - Top View

(bump side up)

10.Orientation mark is only on material that is shipped in tape and

reel. The mark is not available on die shipped on grip ring.