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IR2011(S) & (PbF)

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-

eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured

under board mounted and still air conditions.

Symbol

Definition

Min.

Max.

Units

High side floating supply voltage

-0.3

225

High side floating supply offset voltage

High side floating output voltage

Low side fixed supply voltage

-0.3

25

Low side output voltage

-0.3

Logic input voltage (HIN & LIN)

-0.3

Allowable offset supply voltage transient (figure 2)

—

50

V/ns

(8-lead DIP)

—

1.0

(8-lead SOIC)

—

0.625

Thermal resistance, junction to ambient

(8-lead DIP)

—

125

(8-lead SOIC)

—

200

Junction temperature

—

150

Storage temperature

-55

150

Lead temperature (soldering, 10 seconds)

—

300

°

C/W

W

V

°

C

Symbol

Definition

Min.

Max.

Units

High side floating supply absolute voltage

High side floating supply offset voltage

Note 1

200

High side floating output voltage

Low side fixed supply voltage

10

20

Low side output voltage

0

Logic input voltage (HIN & LIN)

COM

5.5

Ambient temperature

-40

125

°

C

Recommended Operating Conditions

For proper operation the device should be used within the recommended conditions. The VS and COM offset ratings

are tested with all supplies biased at 15V differential.

V