V6

MASW-001100-1190

MASW-002100-1191

MASW-003100-1192

HMIC™ Silicon PIN Diode Switches

ADVANCED:

Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

7

Chip Outline Drawing

1,2

MASW-002100-1191

DIM

INCHES

MM

MIN.

MAX.

MIN.

MAX.

A

0.029

0.033

0.73

0.83

B

0.004

0.006

0.10

0.15

C

0.004 REF

0.10 REF

D

0.005 REF

0.13 REF

E

0.009 REF

0.23 REF

F

0.023 REF

0.58 REF

G

0.007 REF

0.17 REF

H

0.004 REF

0.10 REF

Notes:

1.

Topside and backside surface metallization is gold , 2.5μm thick typical.

2.

Yellow areas indicate wire bonding pads