NE3513M04

8

f

o

7

e

g

a

P

0

0

.

1

.

v

e

R

0

0

1

0

J

E

8

2

0

0

S

D

9

0

R

Oct 18, 2011

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions. For soldering methods and

conditions other than those recommended below, contact your nearby sales office.

l

o

b

m

y

S

n

o

i

t

i

d

n

o

C

s

n

o

i

t

i

d

n

o

C

g

n

i

r

e

d

l

o

S

d

o

h

t

e

M

g

n

i

r

e

d

l

o

S

Infrared Reflow

Peak temperature (package surface temperature) : 260°C or below

s

s

e

l

r

o

s

d

n

o

c

e

s

0

1

:

e

r

u

t

a

r

e

p

m

e

t

k

a

e

p

t

a

e

m

i

T

Time at temperature of 220°C or higher

: 60 seconds or less

Preheating time at 120 to 180°C

: 120±30 seconds

Maximum number of reflow processes

: 3 times

Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below

IR260

Partial Heating

Peak temperature (terminal temperature)

: 350°C or below

Soldering time (per side of device)

: 3 seconds or less

Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below

HS350

CAUTION

Do not use different soldering methods together (except for partial heating).

A Business Partner of Renesas Electronics Corporation.