HB52RF649DC-B, HB52RD649DC-B

Data Sheet E0223H30 (Ver. 3.0)

6

Byte No.

Function described

Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value

Comments

85

Manufacturer’s part number

(-75)

0

0

1

1

0

1

1

1

37

7

(-A6)

0

1

0

0

0

0

0

1

41

A

86

Manufacturer’s part number

(-75)

0

0

1

1

0

1

0

1

35

5

(-A6)

0

0

1

1

0

1

1

0

36

6

87

Manufacturer’s part number

0

1

0

0

0

0

1

0

42

B

88

Manufacturer’s part number

(-xxB)

0

0

1

0

0

0

0

0

20

(Space)

(-xxBL)

0

1

0

0

1

1

0

0

4C

L

89

Manufacturer’s part number

0

0

1

0

0

0

0

0

20

(Space)

90

Manufacturer’s part number

0

0

1

0

0

0

0

0

20

(Space)

91

Revision code

0

0

1

1

0

0

0

0

30

Initial

92

Revision code

0

0

1

0

0

0

0

0

20

(Space)

93

Manufacturing date

×

×

×

×

×

×

×

×

××

Year code (BCD)

94

Manufacturing date

×

×

×

×

×

×

×

×

××

Week code (BCD)

95 to 98

Assembly serial number

*

3

99 to 125

Manufacturer specific data

—

—

—

—

—

—

—

—

—

*

4

126

Intel specification frequency

0

1

1

0

0

1

0

0

64

100MHz

127

Intel specification /CE# latency

support

1

1

0

0

1

1

1

1

CF

CL = 2, 3

Notes: 1. All serial PD data are not protected. 0: Serial data, “driven Low”, 1: Serial data, “driven High”. These

SPD are based on Rev.1.2B specification.

2. Byte72 is manufacturing location code. (ex: In case of Japan, byte72 is 4AH. 4AH shows “J” on ASCII

code.)

3. Bytes 95 through 98 are assembly serial number.

4. All bits of 99 through 125 are not defined (“1” or “0”).