• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or

information contained herein without notice.

Non-Magnetic MELF PIN Diode

Rev V2

MADP-011034-10720T

ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for

development. Performance is based on target specifications, simulated results, and/or prototype

measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-

ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has

been fixed. Engineering samples and/or test data may be available. Commitment to produce in

volume is not guaranteed.

1. Exceeding these limits may cause permanent damage

2. Values will de-rate over temperature.

3. Infinite Heat Sink, de-rate to 0W @ +175 °C ,

by –40mW/°C from 25°C to +175 °C

Parameter

Absolute

Maximum

|-150 V|

0.5 A

6.0 W

-65°C to +175°C

+260°C for 30 s

Peak A.C. Forward Surge

Current ( 8.3 mS Single

2.5 A

-65°C to +150°C

Features

♦ Non-Magnetic Package for MRI Applications

♦ Rectangular MELF Ceramic Package

♦ Hermetically Sealed

♦ RoHS Compliant

Description

The MADP-011034-10720T is a surface mount PIN

diode in a non-magnetic Metal Electrode Leadless

Faced (MELF) package. The MADP-011034-10720T

is

manufactured

using

M/A-COM

Technology

Solutions time proven HIPAX technology. The result

is a low inductance ceramic package with no ribbons

or wires. The package utilizes a unique non-magnetic

plating process that provides for a hermetically sealed

component that has extremely low electromagnetic

permeability. Incorporated in the package is a glass

passivated CERMA chip that is full face bonded on

the cathode and anode which maximizes the surface

contact area to minimize the electrical and thermal

resistances. The chip and package have been

comprehensively characterized both electrically and

mechanically to ensure repeatable and predictable

Application

The MADP-011034-10720T is designed for circuit

protection and the tuning of RF coil designs in MRI

applications. When connected in an anti-parallel

configuration these PIN diodes provide excellent

protection from long RF pulses and transient voltage

spikes.

Package Style 1072

Designed for Automated Assembly

This easy to use package design makes automatic

pick and place, indexing and assembly, extremely

easy. The parallel flat surfaces are well suited for

most key jaw or vacuum pick-up techniques. All of the

solderable surfaces are tin plated and compatible with

industry standard reflow and vapor phase soldering

RoHS

The MADP-011034-10720T is fully RoHS compliant

meaning that it contains less than the maximum

allowable concentration of 0.1% by weight for lead,

PBB, PBDE, and 0.01% of cadmium and hexavalent

chromium at raw homogeneous materials level.

There is less than 100ppm of mercury and no

mercury was intentionally added to the component.