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MADP-011034-10720T Datasheet(PDF) 1 Page - M/A-COM Technology Solutions, Inc. |
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MADP-011034-10720T Datasheet(HTML) 1 Page - M/A-COM Technology Solutions, Inc. |
1 / 4 page • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Non-Magnetic MELF PIN Diode Rev V2 MADP-011034-10720T ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop- ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. 1. Exceeding these limits may cause permanent damage 2. Values will de-rate over temperature. 3. Infinite Heat Sink, de-rate to 0W @ +175 °C , by –40mW/°C from 25°C to +175 °C Parameter Absolute Maximum Reverse DC & AC Voltage 1,2 |-150 V| D.C. Forward Current1,2 0.5 A C.W. Power Dissipation 1,2,3 6.0 W Storage Temperature1,2 -65°C to +175°C Mounting Temperature1,2 +260°C for 30 s Peak A.C. Forward Surge Current ( 8.3 mS Single Half Sine Wave )1,2 2.5 A Operating Temperature1,2 -65°C to +150°C Absolute Maximum Ratings1,2,3@ 25°C Features ♦ Non-Magnetic Package for MRI Applications ♦ Rectangular MELF Ceramic Package ♦ Hermetically Sealed ♦ RoHS Compliant Description The MADP-011034-10720T is a surface mount PIN diode in a non-magnetic Metal Electrode Leadless Faced (MELF) package. The MADP-011034-10720T is manufactured using M/A-COM Technology Solutions time proven HIPAX technology. The result is a low inductance ceramic package with no ribbons or wires. The package utilizes a unique non-magnetic plating process that provides for a hermetically sealed component that has extremely low electromagnetic permeability. Incorporated in the package is a glass passivated CERMA chip that is full face bonded on the cathode and anode which maximizes the surface contact area to minimize the electrical and thermal resistances. The chip and package have been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance. Application The MADP-011034-10720T is designed for circuit protection and the tuning of RF coil designs in MRI applications. When connected in an anti-parallel configuration these PIN diodes provide excellent protection from long RF pulses and transient voltage spikes. Package Style 1072 Designed for Automated Assembly This easy to use package design makes automatic pick and place, indexing and assembly, extremely easy. The parallel flat surfaces are well suited for most key jaw or vacuum pick-up techniques. All of the solderable surfaces are tin plated and compatible with industry standard reflow and vapor phase soldering processes. RoHS The MADP-011034-10720T is fully RoHS compliant meaning that it contains less than the maximum allowable concentration of 0.1% by weight for lead, PBB, PBDE, and 0.01% of cadmium and hexavalent chromium at raw homogeneous materials level. There is less than 100ppm of mercury and no mercury was intentionally added to the component. |
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