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B72214P2271K101 Datasheet(PDF) 7 Page - EPCOS |
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B72214P2271K101 Datasheet(HTML) 7 Page - EPCOS |
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7 / 22 page  Test Test methods/conditions Requirement Solderability IEC 60068-2-20, test Ta, method 1 with modified conditions for lead-free solder alloys: 245 °C, 3 s: After dipping the terminals to a depth of approximately 3 mm from the body in a soldering bath of 245 °C for 3 s, the terminals shall be visually examined. The inspection shall be carried out under adequate light with normal eyesight or with the assistance of a magnifier capable of giving a magnification of 4 to 10 times. The dipped surface shall be covered with a smooth and bright solder coating with no more than small amounts of scattered imperfections such as pinholes or un-wetted or de-wetted areas. These imperfections shall not be concentrated in one area. Resistance to soldering heat IEC 60068-2-20, test Tb, method 1A, 260 °C, 10 s: Each lead shall be dipped into a solder bath having a temperature of 260 ±5 °C to a point 2.0 to 2.5 mm from the body of the specimen, be held there for 10 ±1 s and then be stored at room temperature and normal humidity for 1 to 2 h. The change of VV shall be measured and the specimen shall be visually examined. | ∆V/V (1 mA)| ≤5% No visible damage Tensile strength IEC 60068-2-21, test Ua1 After gradually applying the force specified below and keeping the unit fixed for 10 s, the terminal shall be visually examined for any damage. Force for wire diameter: 0.6 mm = 10 N 0.8 mm = 10 N 1.0 mm = 20 N | ∆V/V (1 mA)| ≤5% No break of solder joint, no wire break Leaded varistors B722* AdvanceD-MP, S14 series Page 7 of 22 Please read Cautions and warnings and Important notes at the end of this document. |
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