NTCS0603E3.....T

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Vishay BCcomponents

Revision: 25-Feb-13

2

Document Number: 29056

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DIMENSIONS in millimeters

SOLDERING CONDITIONS

This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum

temperature of 260 °C during 40 s should not be exceeded.

Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.

PACKAGING

TAPE SPECIFICATIONS

All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.

PAPER TAPE

Notes

T

L

1

W

L

2

L

3

L

4

WT

MIN.

MIN.

1.6 ± 0.15

0.8 ± 0.15

0.8 ± 0.15

0.2

0.4

Time (s)

0

50

100

150

200

200

250

100

150

50

0

300

250

260 °C

≈ 245 °C

215 °C

180 °C

130 °C

2 K/s

40 s

10 s

10 s

Reflow Soldering

Lead (Pb)-free Reflow Soldering Profile

260 °C

≈ 245 °C

235 °C

≈ 170 °C

≈ 120 °C

2 K/s

max.

Time (s)

0

50

100

150

200

350

200

250

100

150

50

0

300

40 s max.

≈ 60 s

20 s min.

normal

limit

250

300

6 K/s

max.

2.4

1.0

0.8

Recommended solder land pattern dimensions (mm)

F

W

P

0

P

2

D

0

B

0

A

0

P

1

E

1

JWB288

T

T

1

DIMENSIONS OF PAPER TAPE in millimeters

PARAMETER

DIMENSION

TOLERANCE

1.15

± 0.1

1.9

± 0.1

W8.0

± 0.2

1.75

± 0.1

F

3.5

± 0.05

1.55

± 0.05

4.0

± 0.1

4.0

± 0.1

2.0

± 0.05

T tape thickness

1.1

Max.

< 0.1

-