www.rohm.com

© 2013 ROHM Co., Ltd. All rights reserved.

Data Sheet

SML-Z1 series

lAttention Points In Handling

This product was developed as a surface mount LED especially suitable for reflow soldering.

Please take care of following points when using this device.

1.DESIGNING OF PCB

As for a recommendable solder pattern, Please refer to Fig-1.

The size and direction of the pad pattern

depends on the condition of the PCB,

So, please investigate about the adjustment

thoroughly before designing.

2.SOLDERING (Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu)

LED products do not contain reinforcement

materials such as glass fillers.

Therefore, thermal stress by soldering greatly

influence its reliability.

The temperature conditions for reflow soldering

should therefore be set up according to the

characteristic of this product. (See Fig-2)

Number of reflow process shall be max 2 times

and these processes shall be performed in a row.

Cooling process to normal temperature shall be required

between first and second soldering process.

3.USE OF AUTOMATIC MOUNTING MACHINE

As for this product, the silicone resin is used as encapsulate material and the sealing part on top of LED is soft.

Therefore, please make sure not to apply the pressure upon it, as it might influence reliability.

Moreover, please use the adsorption nozzle when you use the automatic mounting machine so as not to apply

the force directly to this top sealing part.

4.HANDLING AFTER MOUNTING

As shown right drawing, in case outside force is given

to the device, stress is concentrated to the jointed part

between mold resin and substrate.

Therefore there is a possibility to breath the device or PCB.

Careful handing is needed as ROHM cannot guarantee the falling

of the device by outside force after mounting.

Min.1 min Max. 40sec

Max.250ºC, Within

140 to 180ºC

230 to

(Fig-1)

PCB Bonding Direction

2.6mm

1.5mm

1.5mm

1.5mm

(Fig-2)

Soldering

PCB

Emitting Direction

Outside

9/10

2013.08 - Rev.C