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GXAA0900TTTC Datasheet(PDF) 8 Page - List of Unclassifed Manufacturers

Part # GXAA0900TTTC
Description  MICROTEMP Thermal Cutoffs INTRODUCTION
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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Product Nomenclature
MICROTEMP
® TCO
MICROTEMP
® TCO Packages
Figure 7
As shown in figure 7, Therm-O-Disc MICROTEMP
® TCOs follow a consistent product nomenclature that identifies the
basic product type, lead wire size, special features and packaging options. For example, a standard G4 series TCO
calibrated to open at 192°C would have a part number G4A00192C.
MICROTEMP
® TCO Product Markings
Primary TCOs
Secondary Packages
XXXXXXXX
Special customer identification
XXXXXXXXX
Special customer identification
(when required, up to 9 characters)
(when required, up to 9 characters)
MICROTEMP
®
Registered trademark
MICROTEMP
®
Registered trademark
P ZZZZZ
(P) Manufacturing plant;
(may be T-O-D)
(ZZZZZ) Date code
G Z X X XX RR
Part number (see figure 7)
G Z X XX
Part number (see figure 7)
TF TTTC P ZZ
(TF TTTC) Maximum open temperature °C;
TF TTTC
() Underwriters Labs logo;
(P) Manufacturing plant location;
(TF TTTC) Maximum open
(ZZ) Manufacture date code;
temperature °C
(
) Underwriters Labs logo
G
Z
X
X
XX
RR
TTTC
G – Rating type
(G – Global, Y-Non Agency)
Z – Internal construction
(4, 5, 6, 7, 8, 9)
X – Case material and lead wire
(A, C, D, F)
TTTC – Maximum
open temperature in
°C
RR – Assembly modifications
(Plating, terminal bend, stenciling)
XX – Specific package construction
(00-99)
X – General packages TCO type
(Configuration, potted, mounting base, etc.)
G
Z
X
XX
TTTC
G – Rating type
(G – Global, Y – Non Agency, R – Regional)
Z – Internal construction
(4, 5, 6, 7, 8, 9)
TTTC – Maximum
open temperature in
°C
XX – Modification of basic TCO
(Plating, lead material,
lead length, stenciling)
X – Case material and lead wire
(A, C, D, E, F)


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