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RU1005 Datasheet(PDF) 4 Page - Samsung semiconductor |
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RU1005 Datasheet(HTML) 4 Page - Samsung semiconductor |
4 / 20 page Recommended Soldering Conditions 6 7 Since Chip resistors come into direct contact with melted solder during soldering, it is exposed to potential mechanical stress caused by the sudden temperature change. The chip resistors may also be subject to silver migration and flux contamination. •There are 3 soldering methods. - Flow(wave) soldering. - Reflow soldering. (Reflow soldering is broadly divided into the total heating method and local heating method.) - Iron soldering. •Features PCB solder Primary wave Secondary wave There are two types of soldering methods in flow(wave) soldering. One is single wave soldering, and the other is a double waves soldering. However, double waves soldering is mainly used. This method is designed for continuous and multiple dipping process by using primary and secondary wave, having completely different waveforms and characteristics. With the primary wave, a comparatively strong jet flow is used to remove the flux gas and to solder. With the secondary wave, it is used to remove excessive solder. With the primary wave, the solder flows into a very small gap between components and air bubbles remaining on the soldered joint are removed. With the secondary wave, the peel back is used to prevent bridging. •Preheating If a chip component is heated suddenlyduring soldering, it may crack by the thermal shock caused by the temperature difference between the surface and the inside of the chip. To prevent this, a full preheating is necessary. In case of wave soldering, the temperature difference between solder and surface of the component should be kept within 150℃. Also when cooling is done by dipping into solvent, care should be taken to keep the temperature difference within 150℃. •Standard Soldering Condition Soldering must be carried out without exceeding the approved soldering temperature and time shown within the shaded area of the graph at right. An excessively long soldering time or high soldering temperature results in leaching of outer terminations. When a PCB is warped, mechanical stress applied to the chip will be increased and might cause chip crack, especially if there is a big amount of solder on the chip. So, care should be taken not to use excessive amount of solder on the PCB. For the flow(wave) soldering, the solder amount can be controlled by land size. Soldering Methods Reflow Soldering Total Heating Local Heating Laser Wave Soldering Single Wave Double Waves Infrared Ray Iron Soldering Convection/Infrared Hot Air Hot Plate Optical Beam Air Heater •Pre-heating and cooling In the reflow soldering method, a full pre-heating at the proper temperature is necessary to dry and activate solder paste. Tomb-stoning can be reduced by preheating at 150~180℃ for more than 1 minute. Also when cooling is done by dipping into solvent, care should be taken to keep the temperature difference within 150℃. •Standard Reflow Soldering Condition Soldering must be carried out without exceeding the approved soldering temperature and time shown within the shaded area of the right graph. This prevents the terminations from leaching and characteristics from deteriorating. When soldering is repeated, the allowed time is the accumulated time. •Standard solder amount When a PCB is warped, mechanical stress applied to the chip should be reduced, and to do so, care should be taken not to use excessive amount of solder on the PCB. In the case of the reflow method, the thickness of the coated solder paste is controlled to prevent excessive solder. The thickness of solder paste should be 100~300㎛. When using a soldering iron or any other soldering operation, the permissible temperature and time should not exceed that of the reflow soldering. In order to prevent the external terminations from leaching and characteristics from deteriorating, the tip of the soldering iron should not touch the chip component (ceramic element, resin case, etc.). Soldering with a soldering iron and correcting with a soldering iron can be performed right under following conditions. Temperature at tip Soldering iron output End of soldering iron Note 350 ℃ Max. 20-Watt Max. Ø3mm Max. Do not directly touch the chip by the tip of the iron. Item Condition Ceramic Substrate Inner Electrode Resistor Glass Coat Protective Coat Terminal Coat Ni Plate Sn Plate Al2O3 Ag RuO2 Bi2O3, SiO2 Polymer / Glass Ni-Cr Alloy /Ag Ni Sn Name No. Main Substance < Reflow Soldering> < Flow Soldering> •Tombstoning and Prevention When reflow soldering, or especially vapor phase soldering (VPS), small chip components of less than RC3216 type may break away from solder and stand on end. This is commonly known as tombstoning or the Manhattan phenomenon. - Preventing tombstoning Keep land size as small as possible. Keep the pre-heating conditions properly ( Pre-heating temperature : 150 ~ 180°, Pre-heating time : more than 1 min.) Keep the solder paste quantity not too much and uniform for every lands. Keep the position of chips properly. At around the soldering temperature, keep minimum difference of the temperature between the electrodes of a chip. Abstract Reflow Soldering Iron Soldering General Structure of the Chip Resistor Flow(wave) Soldering Pre-heating 120 sec. min. Time(sec.) Soldering Temp.( ℃) Pre-heating Temp.( ℃) Gradual Cooling in the air 260 ±5℃ 5 sec. max. (Ⅰ)1206(3216) and below :150 ℃ max. △T Pre-heating 217 ℃ Soldering Temp.( ℃) 200 ℃ 150 ℃ Gradual Cooling in the air 260 ±5℃ 10 sec. max. Time(sec.) The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. General Structure Operation Notes Example of land Pattern Design Recommended Soldering Conditions General Structure General Precision Jumper Low ohms (RUT Series) Ultra Low ohms (RU Series) Ultra Low Ohms (RUK Series) Ultra Low Ohms (RJ Series) Arrays (CONVEX Type) Arrays (CONCAVE Type) Arrays (FLAT Type) Anti-Sulfur Resistors Attenuator Characteristics Performance Packaging Standard Resistance Value |
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