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NTD70N03RT4G Datasheet(PDF) 1 Page - ON Semiconductor

Part # NTD70N03RT4G
Description  Power MOSFET 72 A, 25 V, N-Channel DPAK
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NTD70N03RT4G Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2008
March, 2008 - Rev. 10
1
Publication Order Number:
NTD70N03R/D
NTD70N03R
Power MOSFET
72 A, 25 V, N-Channel DPAK
Features
Planar HD3e Process for Fast Switching Performance
Low RDS(on) to Minimize Conduction Loss
Low CISS to Minimize Driver Loss
Low Gate Charge
Pb-Free Packages are Available
MAXIMUM RATINGS (TJ = 25°C Unless otherwise specified)
Parameter
Symbol
Value
Unit
Drain-to-Source Voltage
VDSS
25
Vdc
Gate-to-Source Voltage - Continuous
VGS
±20
Vdc
Thermal Resistance - Junction-to-Case
Total Power Dissipation @ TC = 25°C
Drain Current
- Continuous @ TC = 25°C, Chip
- Continuous @ TC = 25°C, Limited by Package
- Continuous @ TA = 25°C, Limited by Wires
- Single Pulse (tp = 10 ms)
RqJC
PD
ID
ID
ID
IDM
2.4
62.5
72.0
62.8
32
140
°C/W
W
A
A
A
A
Thermal Resistance - Junction-to-Ambient
(Note1)
Total Power Dissipation @ TA = 25°C
Drain Current - Continuous @ TA = 25°C
RqJA
PD
ID
80
1.87
12.0
°C/W
W
A
Thermal Resistance - Junction-to-Ambient
(Note2)
Total Power Dissipation @ TA = 25°C
Drain Current - Continuous @ TA = 25°C
RqJA
PD
ID
110
1.36
10.0
°C/W
W
A
Operating and Storage Temperature Range
TJ, Tstg
-55 to
175
°C
Single Pulse Drain-to-Source Avalanche
Energy - Starting TJ = 25°C
(VDD = 30 Vdc, VGS = 10 Vdc, IL = 12 Apk,
L = 1 mH, RG = 25 W)
EAS
71.7
mJ
Maximum Lead Temperature for Soldering
Purposes, 1/8
″ from Case for 10 s
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 0.5 sq. in. pad size.
2. When surface mounted to an FR4 board using minimum recommended
pad size.
http://onsemi.com
D
S
G
N-Channel
1
Gate
3
Source
2
Drain
4
Drain
DPAK
CASE 369AA
STYLE 2
MARKING DIAGRAMS
70N03
= Device Code
Y
= Year
WW
= Work Week
G
= Pb-Free Package
1 2
3
4
1
Gate
3
Source
2
Drain
4
Drain
DPAK
CASE 369D
STYLE 2
1
2
3
4
25 V
5.6 m
W
RDS(on) TYP
72 A
ID MAX
V(BR)DSS
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION


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