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LMV862MMNOPB Datasheet(PDF) 2 Page - Texas Instruments |
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LMV862MMNOPB Datasheet(HTML) 2 Page - Texas Instruments |
2 / 26 page LMV861, LMV862 SNOSAZ5A – FEBRUARY 2008 – REVISED JULY 2008 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Human Body Model 2 kV ESD Tolerance(3) Charge-Device Model 1 kV Machine Model 200V VIN Differential ± Supply Voltage Supply Voltage (VS = V + – V−) 6V Voltage at Input/Output Pins V+ +0.4V V− −0.4V Storage Temperature Range −65°C to +150°C Junction Temperature(4) +150°C Soldering Information Infrared or Convection (20 sec) 260°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics Tables. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (4) The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board. Operating Ratings (1) Temperature Range(2) −40°C to +125°C Supply Voltage (VS = V + – V−) 2.7V to 5.5V Package Thermal Resistance ( θJA (2)) 5-Pin SC70 302°C/W 8-Pin VSSOP 217°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics Tables. (2) The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board. 3.3V Electrical Characteristics (1) Unless otherwise specified, all limits are guaranteed for TA = 25°C, V + = 3.3V, V− = 0V, V CM = V +/2, and R L =10 kΩ to V +/2. Boldface limits apply at the temperature extremes. Symbol Parameter Conditions Min Typ Max Units (2) (3) (2) VOS Input Offset Voltage(4) ±273 ±1000 μV 1260 TCVOS Input Offset Voltage Temperature ±0.7 ±2.6 μV/°C Drift(4)(5) IB Input Bias Current(5) 0.1 10 pA 500 IOS Input Offset Current 1 pA (1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. (2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlations using statistical quality control (SQC) method. (3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material. (4) The typical value is calculated by applying absolute value transform to the distribution, then taking the statistical average of the resulting distribution (5) This parameter is guaranteed by design and/or characterization and is not tested in production. 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Links: LMV861 LMV862 |
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