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IRFR9010 Datasheet(PDF) 1 Page - Vishay Siliconix

Part # IRFR9010
Description  Power MOSFET
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

IRFR9010 Datasheet(HTML) 1 Page - Vishay Siliconix

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IRFR9010, IRFU9010, SiHFR9010, SiHFU9010
www.vishay.com
Vishay Siliconix
S13-0167-Rev. D, 04-Feb-13
1
Document Number: 91378
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Power MOSFET
FEATURES
• Surface
Mountable
(Order
as
IRFR9010,
SiHFR9010)
• Straight Lead Option (Order as IRFU9010,
SiHFU9010)
• Repetitive Avalanche Ratings
• Dynamic dV/dt Rating
• Simple Drive Requirements
• Ease of Paralleling
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
The power MOSFET technology is the key to Vishay’s
advanced line of power MOSFET transistors. The efficient
geometry and unique processing of this latest “State of the
Art”
design
achieves:
very
low
on-state
resistance
combined with high transconductance; superior reverse
energy and diode recovery dV/dt capability.
The power MOSFET transistors also feature all of the well
established advantages of MOSFETs such as voltage
control, very fast switching, ease of paralleling and
temperature stability of the electrical parameters.
Surface mount packages enhance circuit performance by
reducing stray inductances and capacitance. The DPAK
(TO-252) surface mount package brings the advantages of
power MOSFETs to high volume applications where PC
Board surface mounting is desirable. The surface mount
option IRFR9010, SiHFR9010 is provided on 16 mm tape.
The straight lead option IRFU9010, SiHFU9010 of the device
is called the IPAK (TO-251).
They are well suited for applications where limited heat
dissipation is required such as, computers and peripherals,
telecommunication equipment, DC/DC converters, and a
wide range of consumer products.
Note
a. See device orientation.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 14).
b. VDD = - 25 V, starting TJ = 25 °C, L = 9.7 mH, Rg = 25 , peak IL = - 5.3 A.
c. ISD  - 5.3 A, dI/dt  - 80 A/μs, VDD  40 V, TJ  150 °C, suggested Rg = 24 .
d. 0.063" (1.6 mm) from case.
PRODUCT SUMMARY
VDS (V)
- 50
RDS(on) ()VGS = - 10 V
0.50
Qg (Max.) (nC)
9.1
Qgs (nC)
3.0
Qgd (nC)
5.9
Configuration
Single
S
G
D
P-Channel MOSFET
DPAK
(TO-252)
IPAK
(TO-251)
G
D S
S
D
G
D
ORDERING INFORMATION
Package
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
IPAK (TO-251)
Lead (Pb)-free and Halogen-free
SiHFR9010-GE3
SiHFR9010TR-GE3a
SiHFR9010TRL-GE3a
SiHFU9010-GE3
Lead (Pb)-free
IRFR9010PbF
IRFR9010TRPbFa
IRFR9010TRLPbFa
IRFU9010PbF
SiHFR9010-E3
SiHFR9010T-E3a
SiHFR9010TL-E3a
SiHFU9010-E3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
VDS
- 50
V
Gate-Source Voltage
VGS
± 20
Continuous Drain Current
VGS at - 10 V
TC = 25 °C
ID
- 5.3
A
TC = 100 °C
- 3.3
Pulsed Drain Currenta
IDM
- 21
Linear Derating Factor
0.20
W/°C
Single Pulse Avalanche Energyb
EAS
136
mJ
Repetitive Avalanche Currenta
IAR
- 5.3
A
Repetitive Avalanche Energya
EAR
2.5
mJ
Maximum Power Dissipation
TC = 25 °C
PD
25
W
Peak Diode Recovery dV/dtc
dV/dt
5.8
V/ns
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to + 150
°C
Soldering Recommendations (Peak Temperature)d
for 10 s
300


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