DNP325-4

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Through-hole IRED/φ5 High Radiant Intensity Type

TTW (Through The Wave) soldering Conditions

Solder Bath Temp.

Dipping Time

265 ℃

5 s

(MAX.)

(MAX.)

Position

At least 3.0 mm away from resin body

Iron tip temp.

Soldering time and frequency

3 s

1 time

400 ℃

(MAX.)

(MAX.)

(MAX.) (30 W Max.)

Position

At least 3.0 mm away from resin body

2006.3.31

Pre-heating

100 ℃

(MAX.) Resin surface temperature

1) The dip soldering process shall be 2 times maximum.

2) The product shall be cooled to normal temperature before the second dipping process.

※The detail is described to LED and Photodetector handling precautions of home page:

"Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please.

Manual Soldering Conditions

※The detail is described to LED and Photodetector handling precautions of home page:

"Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please.