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L-03C2N7SV4T Datasheet(PDF) 5 Page - Johanson Technology Inc.

Part No. L-03C2N7SV4T
Description  RF CERAMIC CHIP INDUCTORS
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Maker  JOHANSON [Johanson Technology Inc.]
Homepage  http://www.johansontechnology.com
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20
www.johansontechnology.com
21
www.johansontechnology.com
www.johansontechnology.com
1.0
10
100
500
0.01
0.1
1.0
10
Frequency (GHz)
47N
27N
15N
6N8
3N3
1N5
INDUCTANCE VS FREQUENCY: SIZE 0402
Frequency (GHz)
1.0
10
100
1000
0.01
0.1
1.0
10
Frequency (GHz)
R10
56N
27N
12N
4N7
2N2
INDUCTANCE VS FREQUENCY: SIZE 0603
Frequency (GHz)
1.0
10
100
1000
0.01
0.1
1.0
10
Frequency (GHz)
R10
56N
27N
12N
4N7
2N2
R15
INDUCTANCE VS FREQUENCY: SIZE 0805
Frequency (GHz)
0
20
40
60
80
100
0.01
0.1
1.0
10
Frequency (GHz)
1N5
3N3
6N8
15N
47N
27N
Q VS FREQUENCY: SIZE 0402
Frequency (GHz)
0
20
40
60
80
100
0.01
0.1
1.0
10
Frequency (GHz)
2N2
4N7
12N
27N
R10
56N
Q VS FREQUENCY: SIZE 0603
Frequency (GHz)
0
50
100
150
0.01
0.1
1.0
10
Frequency (GHz)
2N2
4N7
12N
27N
R10
56N
R15
Q VS FREQUENCY: SIZE 0805
Frequency (GHz)
RF CHARACTERISTICS CHARACTERISTICS (TYPICAL)
MECHANICAL & ENVIRONMENTAL CHARACTERISTICS
SOLDERABILITY:
RESISTANCE TO SOLDERING:
THERMAL SHOCK:
LIFE TEST:
HUMIDITY RESISTANCE:
TERMINAL ADHESION:
PCB DEFLECTION:
SPECIFICATION
TEST PARAMETERS
Solder coverage
≥ 75% of electrodes L=±10% Q=± 20%
Preheat 120±20°C for 1 min. Dip 230±10°C for 3±1 sec.
No apparent damage Solder coverage
≥ 75% L=±10% Q=± 20%
Preheat 120±20°C for 1 min. Dip 260±10°C for 10±1 sec.
No apparent damage L=±10% Q=± 20%
100 cycles: 30±3 minutes @ +100°C then 30±3 min. @ -40°C
No apparent damage L=±10% Q=± 20%
1000 ±48 Hours @ +85±2°C, rated current (1-2 hour recovery)
Inductance change: 2% or .5pF Max
1000 ±48 Hours @ +40±2°C, 90-95% relative humidity,
rated current (1-2 hour recovery)
Termination should not pull off.
Lateral pull force: 0201
≥1.0Lbs 0402 ≥1.6Lbs
Ceramic should remain undamaged.
For 0603
≥ 2.2Lbs For 0805 ≥4.4Lbs
No mechanical damage.
Glass Epoxy PCB: 1 mm deflection




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