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IO165RSB2 Datasheet(PDF) 10 Page - Microsemi Corporation

Part # IO165RSB2
Description  ProASIC3 Flash Family FPGAs with Optional Soft ARM Support
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

IO165RSB2 Datasheet(HTML) 10 Page - Microsemi Corporation

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ProASIC3 Flash Family FPGAs
Re vi s i on 15
2 - 5
The absolute maximum junction temperature is 100°C. EQ 1 shows a sample calculation of the absolute
maximum power dissipation allowed for a 484-pin FBGA package at commercial temperature and in still
air.
EQ 1
Maximum Power Allowed
Max. junction temp. (
°C) Max. ambient temp. (°C)
θ
ja(°C/W)
------------------------------------------------------------------------------------------------------------------------------------------
100
°C70°C
20.5
°C/W
-------------------------------------
1.463 W
·
=
=
=
Table 2-5 •
Package Thermal Resistivities
Package Type
Device
Pin Count
θjc
θja
Units
Still Air
200 ft./min.
500 ft./min.
Quad Flat No Lead
A3P030
132
0.4
21.4
16.8
15.3
°C/W
A3P060
132
0.3
21.2
16.6
15.0
°C/W
A3P125
132
0.2
21.1
16.5
14.9
°C/W
A3P250
132
0.1
21.0
16.4
14.8
°C/W
Very Thin Quad Flat Pack (VQFP)
All devices
100
10.0
35.3
29.4
27.1
°C/W
Thin Quad Flat Pack (TQFP)
All devices
144
11.0
33.5
28.0
25.7
°C/W
Plastic Quad Flat Pack (PQFP)
All devices
208
8.0
26.1
22.5
20.8
°C/W
PQFP with embedded heatspreader
All devices
208
3.8
16.2
13.3
11.9
°C/W
Fine Pitch Ball Grid Array (FBGA)
See note*
144
3.8
26.9
22.9
21.5
°C/W
See note*
256
3.8
26.6
22.8
21.5
°C/W
See note*
484
3.2
20.5
17.0
15.9
°C/W
A3P1000
144
6.3
31.6
26.2
24.2
°C/W
A3P1000
256
6.6
28.1
24.4
22.7
°C/W
A3P1000
484
8.0
23.3
19.0
16.7
°C/W
Note:
*This information applies to all ProASIC3 devices except the A3P1000. Detailed device/package thermal
information will be available in future revisions of the datasheet.


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